BAS16T,115 NXP Semiconductors, BAS16T,115 Datasheet - Page 14

• Manufacturer Part Number: BAS16T,115
• Description: DIODE SW 85V 155MA H-S SC-75
• Manufacturer: NXP Semiconductors

Specifications of BAS16T,115

• Package / Case: EMT3 (SOT-416, SC-75-3)
• Mounting Type: Surface Mount
• Speed: Small Signal =< 200mA (Io), Any Speed
• Reverse Recovery Time (trr): 4ns
• Current - Reverse Leakage @ Vr: 500nA @ 80V
• Voltage - Forward (vf) (max) @ If: 1.25V @ 150mA
• Voltage - Dc Reverse (vr) (max): 100V
• Capacitance @ Vr, F: 1.5pF @ 0V, 1MHz
• Current - Average Rectified (io): 155mA (DC)
• Product: Switching Diodes
• Peak Reverse Voltage: 100 V
• Forward Continuous Current: 0.155 A
• Max Surge Current: 4 A
• Configuration: Single
• Recovery Time: 4 ns
• Forward Voltage Drop: 1.25 V
• Maximum Reverse Leakage Current: 1 uA
• Operating Temperature Range: + 150 C
• Maximum Operating Temperature: + 150 C
• Minimum Operating Temperature: - 65 C
• Mounting Style: SMD/SMT
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Lead free / RoHS Compliant
• Other names: 934054831115::BAS16T T/R::BAS16T T/R

NXP Semiconductors
BAS16_SER_5
Product data sheet
Fig 23. Reflow soldering footprint BAS16VV (SOT666)
Fig 24. Reflow soldering footprint BAS16VY (SOT363/SC-88)
2
1.7
1.075
2.35
Reflow soldering is the only recommended soldering method.
0.538
1.5
(4 )
0.6
0.55
(2 )
(4 )
0.5
Rev. 05 — 25 August 2008
0.45
(4 )
(4 )
0.5
(4 )
(4 )
0.5
0.6
2.65
1.8
2.75
2.45
2.1
1.6
1.7
(2 )
0.6
0.65
(2 )
(2 )
0.6
0.4 (2 )
(6 )
0.4
0.325
0.25
(2 )
(4 )
High-speed switching diodes
0.375
BAS16 series
(2 )
(4 )
0.3
Dimensions in mm
Dimensions in mm
© NXP B.V. 2008. All rights reserved.
solder lands
solder resist
solder paste
occupied area
sot363_fr
solder lands
placement area
solder paste
occupied area
sot666_fr
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