RB751S40,115 NXP Semiconductors, RB751S40,115 Datasheet
RB751S40,115
Specifications of RB751S40,115
RB751S40 T/R
RB751S40 T/R
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RB751S40,115 Summary of contents
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RB751 series Schottky barrier single diodes Rev. 01 — 21 May 2007 1. Product profile 1.1 General description Planar Schottky barrier single diodes with an integrated guard ring for stress protection, encapsulated in small Surface-Mounted Device (SMD) plastic packages. Table ...
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... NXP Semiconductors 2. Pinning information Table 3. Pin SOD882 1 2 SOD323; SOD523 1 2 [1] The marking bar indicates the cathode. 3. Ordering information Table 4. Type number RB751CS40 RB751S40 RB751V40 4. Marking Table 5. Type number RB751CS40 RB751S40 RB751V40 RB751_SER_1 Product data sheet Pinning Description cathode anode cathode ...
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... NXP Semiconductors 5. Limiting values Table 6. In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol V RRM FSM P tot amb T stg [1] Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard footprint. [2] Reflow soldering is the only recommended soldering method. ...
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... NXP Semiconductors (mA) 10 (1) (2) (3) ( 0.2 0.4 ( 125 C amb ( amb ( amb ( amb Fig 1. Forward current as a function of forward voltage; typical values MHz amb Fig 3. Diode capacitance as a function of reverse voltage; typical values RB751_SER_1 Product data sheet mlc361 ( A) 0.6 0 (V) F (1) T (2) T (3) T Fig 2 ...
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... NXP Semiconductors 8. Package outline 0.62 0.55 2 0.30 0.22 0.65 0.30 0.22 1 0.55 cathode marking on top side 0.47 Dimensions in mm Fig 4. Package outline SOD882 Fig 6. Package outline SOD323 (SC-76) 9. Packing information Table 9. The indicated -xxx are the last three digits of the 12NC ordering code. ...
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... NXP Semiconductors 10. Soldering Fig 7. Reflow soldering footprint SOD882 Fig 8. Reflow soldering footprint SOD523 (SC-79) RB751_SER_1 Product data sheet 0.90 0.30 solder lands (2 ) 0.40 solder paste (2 ) 0.50 solder resist (2 ) occupied area Reflow soldering is the only recommended soldering method. Dimensions ...
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... NXP Semiconductors Fig 9. Reflow soldering footprint SOD323 (SC-76) Fig 10. Wave soldering footprint SOD323 (SC-76) RB751_SER_1 Product data sheet 3.05 2.80 2.10 1.60 1.65 0.95 0. Dimensions in mm 5.00 4.40 1.40 2.75 1.20 preferred transport direction during soldering Dimensions in mm Rev. 01 — 21 May 2007 ...
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... NXP Semiconductors 11. Revision history Table 10. Revision history Document ID Release date RB751_SER_1 20070521 RB751_SER_1 Product data sheet Data sheet status Change notice Product data sheet - Rev. 01 — 21 May 2007 RB751 series Schottky barrier single diodes Supersedes - © NXP B.V. 2007. All rights reserved. ...
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... For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail ...
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... NXP Semiconductors 14. Contents 1 Product profi 1.1 General description 1.2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.4 Quick reference data Pinning information . . . . . . . . . . . . . . . . . . . . . . 2 3 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 4 Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 5 Limiting values Thermal characteristics Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 3 8 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 5 9 Packing information Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 11 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . 8 12 Legal information ...