BAS21H,115 NXP Semiconductors, BAS21H,115 Datasheet
BAS21H,115
Specifications of BAS21H,115
BAS21H T/R
BAS21H T/R
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BAS21H,115 Summary of contents
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BAS21H Single high-voltage switching diode Rev. 02 — 3 November 1. Product profile 1.1 General description Single high-voltage switching diode, encapsulated in a SOD123F small and flat lead Surface-Mounted Device (SMD) plastic package. 1.2 Features I Small and flat lead ...
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... NXP Semiconductors 2. Pinning information Table 2. Pin 1 2 [1] The marking bar indicates the cathode. 3. Ordering information Table 3. Type number BAS21H 4. Marking Table 4. Type number BAS21H BAS21H_2 Product data sheet Pinning Description cathode anode Ordering information Package Name Description - plastic surface-mounted package; 2 leads Marking codes Rev. 02 — ...
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... NXP Semiconductors 5. Limiting values Table 5. In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol V RRM FRM I FSM P tot amb T stg [1] Pulse test prior to surge. j [3] Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard footprint. 6. Thermal characteristics Table 6 ...
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... NXP Semiconductors 7. Characteristics Table unless otherwise specified. amb Symbol Parameter [1] Pulse test: t [2] When switched from I BAS21H_2 Product data sheet Characteristics Conditions forward voltage I = 100 200 mA F reverse current V = 200 200 diode capacitance MHz R reverse recovery time 300 s; 0.02 mA Rev. 02 — 3 November ...
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... NXP Semiconductors 600 I F (mA) (1) 400 200 ( 150 C; typical values amb ( typical values amb ( maximum values amb Fig 1. Forward current as a function of forward voltage (1) ( 100 ( maximum values R Rmax ( typical values R Rmax Fig 3. Reverse current as a function of junction temperature BAS21H_2 Product data sheet ...
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... NXP Semiconductors 8. Test information D.U. ( Fig 5. Reverse recovery time test circuit and waveforms 9. Package outline Fig 6. Package outline SOD123F 10. Packing information Table 8. The indicated -xxx are the last three digits of the 12NC ordering code. Type number BAS21H [1] For further information and the availability of packing methods, see ...
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... NXP Semiconductors 11. Soldering Fig 7. Reflow soldering footprint SOD123F 12. Mounting Fig 8. FR4 PCB, standard footprint SOD123F BAS21H_2 Product data sheet 4.4 4 2.9 1.6 2.1 1.6 1 Reflow soldering is the only recommended soldering method. Dimensions in mm 1.2 Dimensions in mm PCB thickness = 1.6 mm Rev. 02 — ...
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... Release date BAS21H_2 20061103 • Modifications: The format of this data sheet has been redesigned to comply with the new identity guidelines of NXP Semiconductors. • Legal texts have been adapted to the new company name where appropriate. • Section 1.1 “General • Table 1 “Quick reference • ...
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... For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail ...
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... NXP Semiconductors 16. Contents 1 Product profi 1.1 General description 1.2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.4 Quick reference data Pinning information . . . . . . . . . . . . . . . . . . . . . . 2 3 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 4 Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 5 Limiting values Thermal characteristics Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 4 8 Test information . . . . . . . . . . . . . . . . . . . . . . . . . 6 9 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 6 10 Packing information Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 12 Mounting ...