BAS101,215 NXP Semiconductors, BAS101,215 Datasheet
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BAS101,215
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BAS101,215 Summary of contents
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BAS101; BAS101S High-voltage switching diodes Rev. 02 — 14 December 2009 1. Product profile 1.1 General description High-voltage switching diodes, encapsulated in a SOT23 small Surface-Mounted Device (SMD) plastic package. Table 1. Type number BAS101 BAS101S 1.2 Features High switching ...
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... NXP Semiconductors 2. Pinning information Table 3. Pin BAS101 BAS101S Ordering information Table 4. Type number BAS101 BAS101S 4. Marking Table 5. Type number BAS101 BAS101S [ made in Hong Kong * = p: made in Hong Kong * = t: made in Malaysia * = W: made in China BAS101_BAS101S_2 Product data sheet Pinning Description anode not connected cathode ...
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... NXP Semiconductors 5. Limiting values Table 6. In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Per diode V RRM FRM I FSM Per device P tot amb T stg = 25 °C prior to surge [ [2] Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard footprint ...
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... NXP Semiconductors 7. Characteristics Table 8. ° amb Symbol Parameter Per diode V forward voltage F I reverse current R C diode capacitance d t reverse recovery time rr [1] Pulse test: t [2] When switched from I BAS101_BAS101S_2 Product data sheet Characteristics C unless otherwise specified. Conditions I = 100 250 250 V; T ...
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... NXP Semiconductors 500 I F (mA) 400 300 200 (1) (2) 100 0 0 0.5 = 150 °C (1) T amb = 75 °C (2) T amb = 25 °C (3) T amb Fig 1. Forward current as a function of forward voltage; typical values (μ −1 10 − 120 V = 300 V R Fig 3. Reverse current as a function of junction temperature ...
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... NXP Semiconductors 8. Test information D.U.T. I Ω × ( Fig 5. Reverse recovery time test circuit and waveforms 9. Package outline Fig 6. Package outline SOT23 (TO-236AB) 10. Packing information Table 9. The indicated -xxx are the last three digits of the 12NC ordering code. Type number Package BAS101 ...
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... NXP Semiconductors 11. Soldering Dimensions in mm Fig 7. Reflow soldering footprint SOT23 (TO-236AB) 4.60 4.00 Dimensions in mm Fig 8. Wave soldering footprint SOT23 (TO-236AB) BAS101_BAS101S_2 Product data sheet 2.90 2. 0.85 1.30 3.00 0.85 3 0.50 (3x) 0.60 (3x) 1.00 3.30 3.40 1.20 (2x 1.20 3 2.80 4.50 Rev. 02 — 14 December 2009 BAS101 ...
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... NXP Semiconductors 12. Mounting PCB thickness = 1.6 mm Fig 9. FR4 PCB, standard footprint SOT23 (TO-236AB) BAS101_BAS101S_2 Product data sheet BAS101; BAS101S 43.4 0.7 0.6 0.6 0.7 Dimensions in mm Rev. 02 — 14 December 2009 High-voltage switching diodes 40 0.5 006aaa527 © NXP B.V. 2009. All rights reserved. ...
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... Table 10. Revision history Document ID Release date BAS101_BAS101S_2 20091214 • Modifications: This data sheet was changed to reflect the new company name NXP Semiconductors, including new legal definitions and disclaimers. No changes were made to the technical content. • Table 3 BAS101_BAS101S_1 20060908 BAS101_BAS101S_2 Product data sheet ...
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... Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice ...
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... NXP Semiconductors 16. Contents 1 Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.1 General description . . . . . . . . . . . . . . . . . . . . . 1 1.2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.4 Quick reference data . . . . . . . . . . . . . . . . . . . . 1 2 Pinning information . . . . . . . . . . . . . . . . . . . . . . 2 3 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 4 Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 5 Limiting values Thermal characteristics . . . . . . . . . . . . . . . . . . 3 7 Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 4 8 Test information . . . . . . . . . . . . . . . . . . . . . . . . . 6 9 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 6 10 Packing information . . . . . . . . . . . . . . . . . . . . . 6 11 Soldering ...