BAT721,215 NXP Semiconductors, BAT721,215 Datasheet - Page 8

• Manufacturer Part Number: BAT721,215
• Description: DIODE SCHOTTKY 40V 200MA SOT-23
• Manufacturer: NXP Semiconductors

Specifications of BAT721,215

• Package / Case: SOT-23-3, TO-236-3, Micro3™, SSD3, SST3
• Mounting Type: Surface Mount
• Speed: Small Signal =< 200mA (Io), Any Speed
• Current - Reverse Leakage @ Vr: 15µA @ 30V
• Voltage - Forward (vf) (max) @ If: 550mV @ 200mA
• Voltage - Dc Reverse (vr) (max): 40V
• Capacitance @ Vr, F: 50pF @ 0V, 1MHz
• Current - Average Rectified (io): 200mA (DC)
• Product: Schottky Diodes
• Peak Reverse Voltage: 40 V
• Forward Continuous Current: 0.2 A
• Max Surge Current: 1 A
• Configuration: Single
• Forward Voltage Drop: 0.55 V
• Maximum Reverse Leakage Current: 15 uA @ 30 V
• Operating Temperature Range: + 125 C
• Mounting Style: SMD/SMT
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Reverse Recovery Time (trr): -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: 934051290215::BAT721 T/R::BAT721 T/R

NXP Semiconductors
1PS76SB21_BAT721_SER_6
Product data sheet
Fig 8. Reflow soldering footprint SOT23
Fig 9. Wave soldering footprint SOT23
4.60
4.00
Dimensions in mm
Dimensions in mm
1.20
3.00
0.85
0.85
1.30
Rev. 06 — 21 December 2006
2
2
3.40
4.50
2.80
1PS76SB21; BAT721 series
3
1.00
3.30
2.90
2.50
3
1.20 (2x)
0.50 (3x)
1
0.60 (3x)
1
Schottky barrier diodes in small packages
MSA439
0.60
(3x)
2.70
preferred transport direction during soldering
solder lands
solder resist
occupied area
solder lands
solder resist
occupied area
solder paste
© NXP B.V. 2006. All rights reserved.
MSA427
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