STPS1L40U STMicroelectronics, STPS1L40U Datasheet - Page 4
![DIODE SCHOTTKY LDO 1A 40V SMB](/photos/5/36/53650/497-do-214aa_sml.jpg)
STPS1L40U
Manufacturer Part Number
STPS1L40U
Description
DIODE SCHOTTKY LDO 1A 40V SMB
Manufacturer
STMicroelectronics
Datasheet
1.STPS1L40A.pdf
(11 pages)
Specifications of STPS1L40U
Voltage - Forward (vf) (max) @ If
500mV @ 1A
Voltage - Dc Reverse (vr) (max)
40V
Current - Average Rectified (io)
1A
Current - Reverse Leakage @ Vr
35µA @ 40V
Diode Type
Schottky
Speed
Fast Recovery =< 500ns, > 200mA (Io)
Mounting Type
Surface Mount
Package / Case
DO-214AA, SMB
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Reverse Recovery Time (trr)
-
Capacitance @ Vr, F
-
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
STPS1L40U
Manufacturer:
STM
Quantity:
7 450
Characteristics
4/11
Figure 7.
Figure 9.
Figure 11. Relative variation of thermal
1.0
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0.0
1.E-04
7
6
5
4
3
2
1
0
16
14
12
10
1.E-02
1. E- 04
8
6
4
2
0
I M (A)
Z th(j-a) /R th(j-a)
I M (A)
I M
I M
Single pulse
Epoxy printed circuit board,
copper thickness = 35 µm,
recommended pad layout
SMB
δ = 0.5
δ = 0.5
1.E-01
t
t
Non repetitive surge peak forward
current versus overload duration
(maximum values, SMA)
Non repetitive surge peak forward
current versus overload duration
(maximum values, STmite flat)
impedance junction to ambient
versus pulse duration (SMB)
1.E-03
1. E- 03
1.E+00
1.E-02
1. E- 02
t(s)
t(s)
1.E+01
1.E-01
1. E- 01
1.E+02
T a = 25 °C
T a = 125 °C
STmite flat
T c = 125 °C
T c = 25 °C
T c = 75 °C
T a = 75 °C
SMA
t p (s)
1.E+00
1. E+00
Doc ID 5507 Rev 6
1.E+03
Figure 8.
Figure 10. Relative variation of thermal
Figure 12. Relative variation of thermal
1.0
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0.0
1.0
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0.0
1.E-04
7
6
5
4
3
2
1
0
1.E-02
1.E-02
I M (A)
Z th(j-a) /R th(j-a)
Z th(j-a) /R th(j-a)
STmite flat
Single pulse
I M
Epoxy printed circuit board,
copper thickness = 35 µm,
recommended pad layout
Single pulse
Epoxy printed circuit board,
copper thickness = 35 µm,
recommended pad layout
SMA
δ = 0.5
1.E-01
1.E-01
t
Non repetitive surge peak forward
current versus overload duration
(maximum values, SMB)
impedance junction to ambient
versus pulse duration (SMA)
impedance junction to ambient
versus pulse duration (STmite flat)
1.E-03
1.E+00
1.E+00
1.E-02
1.E+01
1.E+01
1.E-01
1.E+02
1.E+02
T a = 125 °C
T a = 25 °C
T a = 75 °C
SMB
STPS1L40
t p (s)
t p (s)
1.E+00
1.E+03
1.E+03