STPS3L60U STMicroelectronics, STPS3L60U Datasheet - Page 6

• Manufacturer Part Number: STPS3L60U
• Description: DIODE SCHOTTKY 3A 60V SMB
• Manufacturer: STMicroelectronics

Specifications of STPS3L60U

• Voltage - Forward (vf) (max) @ If: 620mV @ 3A
• Voltage - Dc Reverse (vr) (max): 60V
• Current - Average Rectified (io): 3A
• Current - Reverse Leakage @ Vr: 150µA @ 60V
• Diode Type: Schottky
• Speed: Fast Recovery =< 500ns, > 200mA (Io)
• Mounting Type: Surface Mount
• Package / Case: DO-214AA, SMB
• Product: Schottky Rectifiers
• Peak Reverse Voltage: 60 V
• Forward Continuous Current: 3 A
• Max Surge Current: 100 A
• Configuration: Single
• Forward Voltage Drop: 0.62 V
• Maximum Reverse Leakage Current: 150 uA
• Operating Temperature Range: + 150 C
• Mounting Style: SMD/SMT
• Current, Forward: 3 A
• Current, Surge: 100 A
• Package Type: STPS3L60U (SMB)
• Primary Type: Rectifier
• Speed, Switching: Switching
• Temperature, Junction, Maximum: +150 °C
• Voltage, Forward: 0.94 V
• Voltage, Reverse: 60 V
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Reverse Recovery Time (trr): -
• Capacitance @ Vr, F: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: 497-6584-2; STPS3L60U

Characteristics
6/11
Figure 15. Reverse leakage current versus
Figure 17. Forward voltage drop versus
Figure 19. Thermal resistance junction to
1.E+02
1.E+01
1.E+00
120
100
30
25
20
15
10
1.E-01
1.E-02
1.E-03
80
60
40
20
5
0
0
0.0
0.0
I
R
FM
0
th(j-a)
I (mA)
0.2
R
(A)
0.5
5
(°C/W)
0.4
(Maximum values)
(Maximum values)
reverse voltage applied
(typical values)
forward current (high level)
ambient versus copper surface
under each lead (SMB)
1.0
Tj=100°C
Tj=100°C
10
(Typical values)
(Typical values)
0.6
Tj=100°C
Tj=100°C
15
1.5
Expoxy printed circuit FR4,
copper thickness = 35 µm
0.8
20
S(Cu)(cm²)
2.0
1.0
25
Tj=125°C
Tj=100°C
1.2
2.5
Tj=25°C
30
1.4
3.0
35
V
FM
1.6
40
(Maximum values)
(V)
3.5
V (V)
Tj=25°C
1.8
R
45
4.0
2.0
50
4.5
2.2
Doc ID 7505 Rev 6
SMB
55
2.4
5.0
60
Figure 16. Junction capacitance versus
Figure 18. Forward voltage drop versus
Figure 20. Thermal resistance junction to
1000
120
100
5
4
3
2
1
0
80
60
40
20
100
0.0
10
0
0.0
I
1
FM
R
C(pF)
th(j-a)
(A)
0.1
0.5
(°C/W)
0.2
reverse voltage applied
(typical values)
forward current (low level)
ambient versus copper surface
under each lead (SMBflat)
1.0
(Maximum values)
(Maximum values)
Tj=100°C
Tj=100°C
0.3
1.5
copper thickness = 35 µm
Expoxy printed circuit FR4,
(Typical values)
(Typical values)
Tj=100°C
Tj=100°C
0.4
2.0
S(Cu)(cm²)
V (V)
R
0.5
2.5
10
(Maximum values)
0.6
3.0
Tj=25°C
V
FM
0.7
(V)
3.5
0.8
4.0
Vosc=30mV
STPS3L60
F=1MHz
Tj=25°C
SMB-Flat
0.9
4.5
100
1.0
5.0