STTH30R04G STMicroelectronics, STTH30R04G Datasheet
STTH30R04G
Specifications of STTH30R04G
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STTH30R04G Summary of contents
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... STTH30R04PI Parameter TO-220AC / DO-247 / D DOP3I µ kHz Sinusoidal p Rev 1 STTH30R04 Ultrafast recovery diode DO-247 STTH30R04W DOP3I D PAK STTH30R04PI Marking STTH30R04D STTH30R04G STTH30R04G STTH30R04W STTH30R04PI Value 400 50 2 PAK T = 120° 90° 500 300 -65 to +175 -40 to +175 Unit ° C ° C 1/10 ...
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Characteristics 1 Characteristics Table 2. Thermal parameters Symbol R th(j-c) Table 3. Static electrical characteristics Symbol (1) I Reverse leakage current R (2) V Forward voltage drop ms, δ < Pulse test ...
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STTH30R04 Figure 1. Conduction losses versus average current 50 45 δ=0.2 40 δ=0.1 35 δ=0. (A) F(AV Figure 3. Relative variation of thermal impedance junction to case ...
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Characteristics Figure 7. Thermal resistance junction to ambient versus copper surface under tab (Epoxy printed circuit board FR4 (cm² Figure 9. ...
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STTH30R04 2 Package information ● Epoxy meets UL94, V0 ● Cooling method: by conduction (C) ● Recommended torque value: 0.8 Nm (TO-220FPAC) / 0.55 Nm (TO-220AC, DOP3I) ● Maximum torque value: 1.0 Nm (TO-220FPAC) / 0.70 Nm (TO-220AC, DOP31) 2 ...
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Package information Table 6. DO-247 dimensions 6/10 Dia Dimensions Ref. Millimeters Min. Typ. Max. Min. A 4.85 5.15 0.191 D 2.20 2.60 ...
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STTH30R04 Table 7. TO-220AC dimensions H2 Ø Ref Diam. I ...
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Package information Table 8. DOP3I dimensions Ø order to meet environmental requirements, ST offers these devices in ECOPACK® packages. These packages have a lead-free second level interconnect. The category of second level interconnect is ...
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... STTH30R04 3 Ordering information Part Number STTH30R04D STTH30R04G STTH30R04G-TR STTH30R04W STTH30R04PI 4 Revision history Date 31-Mar-2007 Marking Package STTH30R04D TO-220AC 2 STTH30R04G D PAK 2 STTH30R04G D PAK STTH30R04W DO-247 STTH30R04PI DOP3I Revision 1 First issue. Ordering information Weight Base qty Delivery mode 1. Tube 1. Tube 1.48 g 1000 Tape and reel 4 ...
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... Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST’s terms and conditions of sale. ...