STTH110RL STMicroelectronics, STTH110RL Datasheet - Page 3
![DIODE ULT FAST 1A 1000V DO-41](/photos/5/36/53643/497-do-41__axial_series_sml.jpg)
STTH110RL
Manufacturer Part Number
STTH110RL
Description
DIODE ULT FAST 1A 1000V DO-41
Manufacturer
STMicroelectronics
Datasheet
1.STTH110.pdf
(6 pages)
Specifications of STTH110RL
Voltage - Forward (vf) (max) @ If
1.7V @ 1A
Voltage - Dc Reverse (vr) (max)
1000V (1kV)
Current - Average Rectified (io)
1A
Current - Reverse Leakage @ Vr
10µA @ 1000V
Diode Type
Standard
Speed
Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr)
75ns
Mounting Type
Through Hole
Package / Case
DO-204AL, DO-41, Axial
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Capacitance @ Vr, F
-
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STTH110
Figure 1.
Figure 3.
Figure 5.
1.8
1.6
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0.0
120
110
100
1.0
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0.0
90
80
70
60
50
40
30
20
10
1.E-01
0
0.0
P(W)
0
Z
R
epoxy FR4, leads = 10 mm
th(j-c)
δ = 0.5
δ = 0.2
Single pulse
δ = 0.1
th(j-a)
0.1
1
/R
(°C/W)
0.2
th(j-c)
Conduction losses versus average
current
Relative variation of thermal
impedance junction ambient versus
pulse duration (DO-41)
Thermal resistance junction to
ambient versus copper surface
under each lead (DO-41)
1.E+00
2
0.3
δ = 0.05
epoxy printed circuit board FR4, copper thickness: 35 µm
3
0.4
0.5
4
δ = 0.1
I
F(AV)
1.E+01
S(cm²)
t (s)
p
0.6
5
(A)
δ = 0.2
0.7
6
0.8
1.E+02
δ = 0.5
7
0.9
δ
δ
=tp/T
=tp/T
8
1.0
T
δ = 1
T
Doc ID 9344 Rev 2
9
1.1
tp
tp
1.E+03
1.2
10
Figure 2.
Figure 4.
Figure 6.
100.0
140
130
120
110
100
1.0
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0.0
10.0
90
80
70
60
50
40
30
20
10
1.E-01
1.0
0.1
0
0.0
Z
R
0.0
th(j-c)
I
th(j-a)
δ = 0.5
Single pulse
FM
δ = 0.2
δ = 0.1
(A)
0.5
(typical values)
/R
0.5
(°C/W)
T =150°C
j
th(j-c)
1.0
Forward voltage drop versus
forward current
Relative variation of thermal
impedance junction ambient versus
pulse duration (epoxy FR4) (SMA)
Thermal resistance junction to
ambient versus copper surface
under each lead (SMA).
1.E+00
1.0
(maximum values)
epoxy printed circuit board FR4, copper thickness: 35 µm
T =150°C
1.5
j
1.5
2.0
2.0
1.E+01
S(cm²)
t (s)
V
p
FM
2.5
(maximum values)
(V)
2.5
T =25°C
3.0
j
3.0
3.5
1.E+02
Characteristics
δ
3.5
=tp/T
4.0
T
4.0
4.5
tp
1.E+03
4.5
5.0
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