SP8M10FU6TB Rohm Semiconductor, SP8M10FU6TB Datasheet

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SP8M10FU6TB

Manufacturer Part Number
SP8M10FU6TB
Description
MOSFET N/P-CH 30V 7A/4.5A 8SOIC
Manufacturer
Rohm Semiconductor
Datasheet

Specifications of SP8M10FU6TB

Fet Type
N and P-Channel
Fet Feature
Logic Level Gate
Rds On (max) @ Id, Vgs
24 mOhm @ 7A, 10V
Drain To Source Voltage (vdss)
30V
Current - Continuous Drain (id) @ 25° C
7A, 4.5A
Vgs(th) (max) @ Id
2.5V @ 1mA
Gate Charge (qg) @ Vgs
11.8nC @ 5V
Input Capacitance (ciss) @ Vds
600pF @ 10V
Power - Max
2W
Mounting Type
Surface Mount
Package / Case
8-SOIC (3.9mm Width)
Configuration
Dual Dual Drain
Transistor Polarity
N and P-Channel
Resistance Drain-source Rds (on)
0.025 Ohms
Drain-source Breakdown Voltage
30 V
Gate-source Breakdown Voltage
+/- 20 V
Continuous Drain Current
7 A, - 4.5 A
Power Dissipation
2 W
Mounting Style
SMD/SMT
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Transistors
Switching
SP8M10
1) Low on-resistance.
2) Built-in G-S Protection Diode.
3) Small and Surface Mount Package (SOP8).
Power switching, DC / DC converter.
Channel to ambient
Drain-source voltage
Gate-source voltage
Drain current
Source current
(Body diode)
Total power dissipation (T
Channel temperature
Storage temperature
MOUNTED ON A CERAMIC BOARD.
1 Pw 10 s, Duty cycle 1%
2 MOUNTED ON A CERAMIC BOARD.
Features
Application
Absolute maximum ratings (Ta=25°C)
Thermal resistance (Ta=25°C)
Parameter
Parameter
Continuous
Pulsed
Continuous
Pulsed
C
25 C)
Symbol
Rth (ch-A)
V
V
Tstg
Tch
I
I
P
Symbol
I
DSS
GSS
DP
I
SP
D
S
D
Nchannel
55 to 150
150
1.6
6.4
30
7.0
20
28
2
Limits
62.5
Limits
Pchannel
55 to 150
150
4.5
1.6
30
20
18
18
2
C / W
Unit
External dimensions (Unit : mm)
SOP8
Unit
W
V
V
A
A
A
A
C
C
1
1
2
A protection diode is included between the gate and
the source terminals to protect the diode against static
electricity when the product is in use. Use the protection
circuit when the fixed voltages are exceeded.
2
Equivalent circuit
1 ESD PROTECTION DIODE
2 BODY DIODE
(8)
(1)
1.27
5.0 0.2
1
(7)
(2)
0.1
Each lead has same dimensions
0.4 0.1
2
(6)
(3)
1
0.2 0.1
(5)
(4)
SP8M10
(1) Tr1 (Nch) Source
(2) Tr1 (Nch) Gate
(3) Tr2 (Pch) Source
(4) Tr2 (Pch) Gate
(5) Tr2 (Pch) Drain
(6) Tr2 (Pch) Drain
(7) Tr1 (Nch) Drain
(8) Tr1 (Nch) Drain
(1) (2) (3) (4)
(8) (7) (6) (5)
1/5

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SP8M10FU6TB Summary of contents

Page 1

Transistors Switching SP8M10 Features 1) Low on-resistance. 2) Built-in G-S Protection Diode. 3) Small and Surface Mount Package (SOP8). Application Power switching converter. Absolute maximum ratings (Ta=25°C) Parameter Symbol Drain-source voltage V DSS Gate-source voltage V GSS ...

Page 2

Transistors N-ch Electrical characteristics (Ta=25°C) Parameter Symbol Gate-source leakage I GSS Drain-source breakdown voltage V (BR) DSS Zero gate voltage drain current I DSS Gate threshold voltage V GS (th) Static drain-source on-state R DS (on) resistance Forward transfer admittance ...

Page 3

Transistors P-ch Electrical characteristics (Ta=25°C) Parameter Symbol Gate-source leakage I GSS Drain-source breakdown voltage V (BR) DSS Zero gate voltage drain current I DSS Gate threshold voltage V GS (th) Static drain-source on-state R DS (on) resistance Forward transfer admittance ...

Page 4

Transistors N-ch Electrical characteristic curves 10000 1MHz 1000 C iss C oss 100 C rss 10 0.01 0 100 DRAIN-SOURCE VOLTAGE : V (V) DS Fig.1 Typical Capacitance vs. Drain-Source Voltage ...

Page 5

Transistors P-ch Electrical characteristic curves 10000 1MHz 1000 C iss C oss 100 C rss 10 0.01 0 100 DRAIN-SOURCE VOLTAGE : V (V) DS Fig.1 Typical Capacitance vs. Drain-Source Voltage ...

Page 6

Appendix No technical content pages of this document may be reproduced in any form or transmitted by any means without prior permission of ROHM CO.,LTD. The contents described herein are subject to change without notice. The specifications for the product ...

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