NTTD1P02R2 ON Semiconductor, NTTD1P02R2 Datasheet - Page 6

• Manufacturer Part Number: NTTD1P02R2
• Description: MOSFET P-CHAN DUAL 20V 8MICRO
• Manufacturer: ON Semiconductor

Specifications of NTTD1P02R2

• Fet Type: 2 P-Channel (Dual)
• Fet Feature: Logic Level Gate
• Rds On (max) @ Id, Vgs: 160 mOhm @ 1.45A, 4.5V
• Drain To Source Voltage (vdss): 20V
• Current - Continuous Drain (id) @ 25° C: 1.45A
• Vgs(th) (max) @ Id: 1.4V @ 250µA
• Gate Charge (qg) @ Vgs: 10nC @ 4.5V
• Input Capacitance (ciss) @ Vds: 265pF @ 16V
• Power - Max: 500mW
• Mounting Type: Surface Mount
• Package / Case: 8-MSOP, Micro8™, 8-uMAX, 8-uSOP,
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Other names: NTTD1P02R2OS

PUBLICATION ORDERING INFORMATION
Micro8 is a registered trademark of International Rectifier Corporation.
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to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
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−T−
0.038 (0.0015)
SEATING
PLANE
PIN 1 ID
H
E
e
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
D D
A1
A
b
*For additional information on our Pb−Free strategy and soldering
E
8 PL
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
0.08 (0.003)
c
8X
0.041
1.04
6X
M
N. American Technical Support: 800−282−9855 Toll Free
USA/Canada
Japan: ON Semiconductor, Japan Customer Focus Center
0.0256
2−9−1 Kamimeguro, Meguro−ku, Tokyo, Japan 153−0051
Phone: 81−3−5773−3850
PACKAGE DIMENSIONS
0.126
0.65
T
SOLDERING FOOTPRINT*
3.20
B
http://onsemi.com
S
CASE 846A−02
A
Micro8t
ISSUE G
L
S
6
0.015
0.38
8X
0.167
NOTES:
SCALE 8:1
4.24
1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE
4. DIMENSION B DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSION.
5. 846A−01 OBSOLETE, NEW STANDARD 846A−02.
STYLE 2:
BURRS. MOLD FLASH, PROTRUSIONS OR GATE BURRS SHALL NOT EXCEED
0.15 (0.006) PER SIDE.
INTERLEAD FLASH OR PROTRUSION SHALL NOT EXCEED 0.25 (0.010) PER SIDE.
DIM
H
A1
PIN 1. SOURCE 1
A
b
c
D
E
e
L
E
2. GATE 1
3. SOURCE 2
4. GATE 2
5. DRAIN 2
6. DRAIN 2
7. DRAIN 1
8. DRAIN 1
0.208
5.28
0.05
0.25
0.13
2.90
2.90
0.40
4.75
MIN
inches
−−
mm
MILLIMETERS
0.65 BSC
NOM
0.08
0.33
0.18
3.00
3.00
0.55
4.90
−−
ON Semiconductor Website: http://onsemi.com
Order Literature: http://www.onsemi.com/litorder
For additional information, please contact your
local Sales Representative.
MAX
1.10
0.15
0.40
0.23
3.10
3.10
0.70
5.05
0.002
0.010
0.005
0.016
0.187
0.114
0.114
MIN
−−
NTTD1P02R2/D
0.026 BSC
INCHES
0.003
0.013
0.007
0.118
0.118
0.021
0.193
NOM
−−
0.043
0.006
0.016
0.009
0.122
0.122
0.028
0.199
MAX