NTHD4502NT1 ON Semiconductor, NTHD4502NT1 Datasheet - Page 6

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NTHD4502NT1

Manufacturer Part Number
NTHD4502NT1
Description
MOSFET N-CHAN DUAL 30V CHIPFET
Manufacturer
ON Semiconductor
Datasheet

Specifications of NTHD4502NT1

Fet Type
2 N-Channel (Dual)
Fet Feature
Logic Level Gate
Rds On (max) @ Id, Vgs
85 mOhm @ 2.9A, 10V
Drain To Source Voltage (vdss)
30V
Current - Continuous Drain (id) @ 25° C
2.2A
Vgs(th) (max) @ Id
3V @ 250µA
Gate Charge (qg) @ Vgs
7nC @ 10V
Input Capacitance (ciss) @ Vds
140pF @ 15V
Power - Max
640mW
Mounting Type
Surface Mount
Package / Case
8-ChipFET™
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
NTHD4502NT1
Manufacturer:
BROADCOM
Quantity:
12
Part Number:
NTHD4502NT1G
Manufacturer:
NXP
Quantity:
36 000
Part Number:
NTHD4502NT1G
Manufacturer:
ON/安森美
Quantity:
20 000
e1
PUBLICATION ORDERING INFORMATION
ChipFET is a trademark of Vishay Siliconix.
LITERATURE FULFILLMENT:
H
Literature Distribution Center for ON Semiconductor
P.O. Box 61312, Phoenix, Arizona 85082−1312 USA
Phone: 480−829−7710 or 800−344−3860 Toll Free USA/Canada
Fax: 480−829−7709 or 800−344−3867 Toll Free USA/Canada
Email: orderlit@onsemi.com
ON Semiconductor and
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should
Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates,
and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death
associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal
Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
E
0.457
0.018
8
1
7
2
0.026
D
0.66
e
6
3
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
5
4
Basic
2.032
0.08
0.711
0.028
b
E
A
*For additional information on our Pb−Free strategy and soldering
SCALE 20:1
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
q
c
0.05 (0.002)
0.635
0.025
SOLDERING FOOTPRINT*
N. American Technical Support: 800−282−9855 Toll Free
USA/Canada
Japan: ON Semiconductor, Japan Customer Focus Center
inches
2−9−1 Kamimeguro, Meguro−ku, Tokyo, Japan 153−0051
Phone: 81−3−5773−3850
PACKAGE DIMENSIONS
mm
L
http://onsemi.com
CASE 1206A−03
NTHD4502N
5
4
ChipFET]
ISSUE G
6
3
STYLE 2:
6
PIN 1. SOURCE 1
7
2
2. GATE 1
3. SOURCE 2
4. GATE 2
5. DRAIN 2
6. DRAIN 2
7. DRAIN 1
8. DRAIN 1
8
1
0.457
0.018
0.635
0.025
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. MOLD GATE BURRS SHALL NOT EXCEED 0.13 MM PER SIDE.
4. LEADFRAME TO MOLDED BODY OFFSET IN HORIZONTAL
5. DIMENSIONS A AND B EXCLUSIVE OF MOLD GATE BURRS.
6. NO MOLD FLASH ALLOWED ON THE TOP AND BOTTOM LEAD
DIM
AND VERTICAL SHALL NOT EXCEED 0.08 MM.
SURFACE.
H
e1
A
D
q
b
c
E
e
L
E
0.026
0.66
1.00
0.25
0.10
2.95
1.55
0.28
1.80
MIN
MILLIMETERS
0.65 BSC
0.55 BSC
5° NOM
ON Semiconductor Website: http://onsemi.com
Order Literature: http://www.onsemi.com/litorder
For additional information, please contact your
local Sales Representative.
NOM
2.032
1.05
0.30
0.15
3.05
1.65
0.35
1.90
0.08
Style 2
0.254
0.010
MAX
1.10
0.35
0.20
3.10
1.70
0.42
2.00
SCALE 20:1
0.039
0.010
0.004
0.061
0.071
0.116
0.011
MIN
NTHD4502N/D
0.025 BSC
0.022 BSC
INCHES
5° NOM
1.092
0.043
0.041
0.012
0.006
0.120
0.065
0.014
0.075
NOM
inches
mm
0.178
0.007
0.043
0.014
0.008
0.122
0.067
0.017
0.079
MAX

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