TDA1308/N2 NXP Semiconductors, TDA1308/N2 Datasheet - Page 15

• Manufacturer Part Number: TDA1308/N2
• Description: Audio Amplifiers HEADPHONE DRIVER; LV
• Manufacturer: NXP Semiconductors

Specifications of TDA1308/N2

• Product: Class-AB
• Output Power: 80 mW
• Available Set Gain: 70 dB
• Thd Plus Noise: 0.03 %
• Operating Supply Voltage: 5 V
• Supply Current: 3 mA
• Maximum Power Dissipation: 25 mW
• Maximum Operating Temperature: + 85 C
• Mounting Style: Through Hole
• Audio Load Resistance: 32 Ohms
• Dual Supply Voltage: +/- 2.5 V
• Input Bias Current (max): 0.00001 uA
• Input Offset Voltage: 10 mV
• Input Signal Type: Differential
• Minimum Operating Temperature: - 40 C
• Output Signal Type: Single
• Supply Type: Single or Dual
• Supply Voltage (max): 7 V
• Supply Voltage (min): 3 V
• Output Type: 2-Channel Stereo
• Package / Case: PDIP-8
• Operational Class: Class-AB
• Audio Amplifier Output Configuration: 2-Channel Stereo
• Audio Amplifier Function: Headphone
• Total Harmonic Distortion: 0.03@32Ohm%
• Single Supply Voltage (typ): 5V
• Dual Supply Voltage (typ): ±2.5V
• Supply Current (max): 5@5VmA
• Power Supply Requirement: Single/Dual
• Power Dissipation: 25mW
• Unity Gain Bandwidth Product (typ): 5.5MHz
• Rail/rail I/o Type: No
• Power Supply Rejection Ratio: 90dB
• Single Supply Voltage (min): 3V
• Single Supply Voltage (max): 7V
• Dual Supply Voltage (min): ±1.5V
• Dual Supply Voltage (max): ±3.5V
• Operating Temp Range: -40C to 85C
• Operating Temperature Classification: Industrial
• Mounting: Through Hole
• Pin Count: 8
• Package Type: PDIP
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: TDA1308/N2,112

NXP Semiconductors
TDA1308_A_4
Product data sheet
14.4 Reflow soldering
Key characteristics in reflow soldering are:
Table 8.
Table 9.
Moisture sensitivity precautions, as indicated on the packing, must be respected at all
times.
Studies have shown that small packages reach higher temperatures during reflow
soldering, see
Package thickness (mm)
< 2.5
Package thickness (mm)
< 1.6
1.6 to 2.5
> 2.5
•
•
•
2.5
Lead-free versus SnPb soldering; note that a lead-free reflow process usually leads to
higher minimum peak temperatures (see
reducing the process window
Solder paste printing issues including smearing, release, and adjusting the process
window for a mix of large and small components on one board
Reflow temperature profile; this profile includes preheat, reflow (in which the board is
heated to the peak temperature) and cooling down. It is imperative that the peak
temperature is high enough for the solder to make reliable solder joints (a solder paste
characteristic). In addition, the peak temperature must be low enough that the
packages and/or boards are not damaged. The peak temperature of the package
depends on package thickness and volume and is classified in accordance with
Table 8
SnPb eutectic process (from J-STD-020C)
Lead-free process (from J-STD-020C)
and
Figure
9
16.
Rev. 04 — 25 January 2007
Package reflow temperature ( C)
Volume (mm
< 350
235
220
Package reflow temperature ( C)
Volume (mm
< 350
260
260
250
3
3
)
)
TDA1308; TDA1308A
Figure
350 to 2000
260
250
245
Class-AB stereo headphone driver
16) than a PbSn process, thus
220
220
350
> 2000
260
245
245
© NXP B.V. 2007. All rights reserved.
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