2N7002E-T1-E3 Vishay, 2N7002E-T1-E3 Datasheet - Page 2

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2N7002E-T1-E3

Manufacturer Part Number
2N7002E-T1-E3
Description
MOSFET N-CH 60V 240MA SOT-23
Manufacturer
Vishay
Datasheets

Specifications of 2N7002E-T1-E3

Transistor Polarity
N-Channel
Fet Type
MOSFET N-Channel, Metal Oxide
Fet Feature
Logic Level Gate
Rds On (max) @ Id, Vgs
3 Ohm @ 250mA, 10V
Drain To Source Voltage (vdss)
60V
Current - Continuous Drain (id) @ 25° C
240mA
Vgs(th) (max) @ Id
2.5V @ 250µA
Gate Charge (qg) @ Vgs
0.6nC @ 4.5V
Input Capacitance (ciss) @ Vds
21pF @ 5V
Power - Max
350mW
Mounting Type
Surface Mount
Package / Case
SOT-23-3, TO-236-3, Micro3™, SSD3, SST3
Minimum Operating Temperature
- 55 C
Configuration
Single
Resistance Drain-source Rds (on)
3 Ohm @ 10 V
Drain-source Breakdown Voltage
60 V
Gate-source Breakdown Voltage
+/- 20 V
Continuous Drain Current
0.24 A
Power Dissipation
350 mW
Maximum Operating Temperature
+ 150 C
Mounting Style
SMD/SMT
Continuous Drain Current Id
240mA
Drain Source Voltage Vds
60V
On Resistance Rds(on)
3ohm
Rds(on) Test Voltage Vgs
10V
Threshold Voltage Vgs Typ
2V
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Lead Free Status / RoHS Status
Lead free / RoHS Compliant, Lead free / RoHS Compliant

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2N7002E
Vishay Siliconix
Notes:
a. For DESIGN AID ONLY, not subject to production testing.
b. Pulse test: pulse width  300 µs duty cycle  2 %.
c. Switching time is essentially independent of operating temperature.
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation
of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum
rating conditions for extended periods may affect device reliability.
www.vishay.com
2
SPECIFICATIONS (T
Parameter
Static
Drain-Source Breakdown Voltage
Gate-Threshold Voltage
Gate-Body Leakage
Zero Gate Voltage Drain Current
On-State Drain Current
Drain-Source On-Resistance
Forward Transconductance
Diode Forward Voltage
Dynamic
Total Gate Charge
Gate-Source Charge
Gate-Drain Charge
Input Capacitance
Output Capacitance
Reverse Transfer Capacitance
Switching
Turn-On Time
Turn-Off Time
a
a, c
b
b
A
b
= 25 °C, unless otherwise noted)
Symbol
R
V
I
t
t
I
C
I
DS(on)
C
V
GS(th)
D(on)
V
Q
C
Q
d(on)
d(off)
GSS
DSS
Q
g
oss
DS
SD
rss
iss
fs
gs
gd
g
I
D
V
DS
 250 mA, V
V
DS
= 60 V, V
V
V
V
V
V
V
V
V
I
= 5 V, V
GS
S
V
V
GS
DS
V
DS
DS
GS
GS
DS
DD
DS
= 200 mA, V
GS
Test Conditions
= 4.5 V, I
= 15 V, I
= 0 V, V
= 10 V, I
= 10 V, V
= V
= 10 V, V
= 4.5 V, V
= 60 V, V
I
= 10 V, R
= 0 V, I
D
GS
 250 mA
GS
GS
GEN
, I
= 0 V , T
= 0 V, f = 1 MHz
GS
D
D
D
D
D
= 10 V, R
GS
DS
DS
= 250 mA
= 250 µA
GS
= 200 mA
= 10 µA
= 200 mA
L
GS
= ± 15 V
= 40 
= 7.5 V
= 4.5 V
= 10 V
= 0 V
= 0 V
J
= 125 °C
g
= 10 
Min.
800
500
60
1
S11-0183-Rev. F, 07-Feb-11
Limits
Typ.
1300
0.85
0.06
0.06
700
600
Document Number: 70860
1.2
1.8
0.4
2.5
68
21
13
18
2
7
a
Max.
± 10
500
2.5
1.2
0.6
20
25
1
3
4
Unit
mA
mS
nC
nA
µA
pF
ns
V
V

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