IRLML5203GTRPBF International Rectifier, IRLML5203GTRPBF Datasheet - Page 8

• Manufacturer Part Number: IRLML5203GTRPBF
• Description: MOSFET P-CH 30V 3A SOT-23-3
• Manufacturer: International Rectifier
• Series: HEXFET®r

Specifications of IRLML5203GTRPBF

• Fet Type: MOSFET P-Channel, Metal Oxide
• Fet Feature: Logic Level Gate
• Rds On (max) @ Id, Vgs: 98 mOhm @ 3A, 10V
• Drain To Source Voltage (vdss): 30V
• Current - Continuous Drain (id) @ 25° C: 3A
• Vgs(th) (max) @ Id: 2.5V @ 250µA
• Gate Charge (qg) @ Vgs: 14nC @ 10V
• Input Capacitance (ciss) @ Vds: 510pF @ 25V
• Power - Max: 1.25W
• Mounting Type: Surface Mount
• Package / Case: SOT-23-3, TO-236-3, Micro3™, SSD3, SST3
• Transistor Polarity: P Channel
• Continuous Drain Current Id: -3A
• Drain Source Voltage Vds: -30V
• On Resistance Rds(on): 98mohm
• Rds(on) Test Voltage Vgs: -10V
• Threshold Voltage Vgs Typ: -2.5V
• Rohs Compliant: Yes
• Resistance Drain-source Rds (on): 165 mOhms
• Drain-source Breakdown Voltage: - 30 V
• Gate-source Breakdown Voltage: 20 V
• Continuous Drain Current: - 3 A
• Power Dissipation: 1.25 W
• Mounting Style: SMD/SMT
• Gate Charge Qg: 9.5 nC
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: IRLML5203GTRPBF; IRLML5203GTRPBFTR

Micro3 (SOT-23 / TO-236AB) Part Marking Information
Note: For the most current drawing please refer to IR website at http://www.irf.com/package
A1
8
A
5
A2
Micro3 / SOT-23 Package Marking
6
B
E1
PART NUMBER
e
HALOGEN FREE
PART NUMBER CODE REFERENCE:
INDICATOR
(as shown here) indicates Lead-free
1
Note: A line above the work week
0.802
3X
3
Recommended Footprint
e1
6
D
D = IRLML5103
G = IRLML2502
H = IRLML5203
0.20 [0.008]
A = IRLML2402
C = IRLML2402
E = IRLML6402
F = IRLML6401
B =IRLML2803
b
0.972
A YW LC
0.10 [0.004] C
2
M
1.900
C
C
B
A
A
W = WEEK
Y = YEAR
0.15 [0.006]
CODE
LOT
5
E
0.950
M C B A
H
2.742
4
3X L
7
L1
L2
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7
8
9
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A
B
C
E
F
NOTES:
1. DIMENSIONING & TOLERANCING PER ANSI Y14.5M-1994
2. DIMENSIONS ARE SHOWN IN MILLIMETERS [INCHES].
3. CONTROLLING DIMENSION: MILLIMETER.
5. DATUM A AND B TO BE DETERMINED AT DATUM PLANE H.
6. DIMENSIONS D AND E1 ARE MEASURED AT DATUM PLANE H. DIMENSIONS DOES
7. DIMENSION L IS THE LEAD LENGTH FOR SOLDERING TO A SUBSTRATE.
8. OUTLINE CONFORMS TO JEDEC OUTLINE TO-236 AB.
4. DATUM PLANE H IS LOCATED AT THE MOLD PARTING LINE.
NOT INCLUDE MOLD PROTRUSIONS OR INTERLEAD FLASH. MOLD PROTRUSIONS
OR INTERLEAD FLASH SHALL NOT EXCEED 0.25 MM [0.010 INCH] PER SIDE.
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XPSF
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SYMBOL
A2
E1
L2
A1
e1
L1
D
E
A
b
c
e
L
X
7
8
9
Y
`
a
X
7
8
9
Y
`
a
MILLIMETERS
1.20
1.90
0.89
0.88
0.30
0.08
2.80
2.10
0.95
0.40
0.54
0.25
0.01
MIN
0
DIMENSIONS
1.12
0.10
1.02
0.50
0.20
3.04
2.64
1.40
BSC
BSC
0.60
REF
BSC
MAX
8
0.0004
www.irf.com
MIN
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INCHES
BSC
REF
MAX
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8