STP3NK80Z STMicroelectronics, STP3NK80Z Datasheet - Page 3

MOSFET N-CH 800V 2.5A TO-220

STP3NK80Z

Manufacturer Part Number
STP3NK80Z
Description
MOSFET N-CH 800V 2.5A TO-220
Manufacturer
STMicroelectronics
Series
SuperMESH™r
Datasheets

Specifications of STP3NK80Z

Fet Type
MOSFET N-Channel, Metal Oxide
Fet Feature
Standard
Rds On (max) @ Id, Vgs
4.5 Ohm @ 1.25A, 10V
Drain To Source Voltage (vdss)
800V
Current - Continuous Drain (id) @ 25° C
2.5A
Vgs(th) (max) @ Id
4.5V @ 50µA
Gate Charge (qg) @ Vgs
19nC @ 10V
Input Capacitance (ciss) @ Vds
485pF @ 25V
Power - Max
70W
Mounting Type
Through Hole
Package / Case
TO-220-3 (Straight Leads)
Configuration
Single
Transistor Polarity
N-Channel
Resistance Drain-source Rds (on)
4.5 Ohms
Forward Transconductance Gfs (max / Min)
2.1 S
Drain-source Breakdown Voltage
800 V
Gate-source Breakdown Voltage
+/- 30 V
Continuous Drain Current
2.5 A
Power Dissipation
70 W
Maximum Operating Temperature
+ 150 C
Mounting Style
Through Hole
Minimum Operating Temperature
- 55 C
Continuous Drain Current Id
2.5A
Drain Source Voltage Vds
800V
On Resistance Rds(on)
4.5ohm
Rds(on) Test Voltage Vgs
10V
Threshold Voltage Vgs Typ
3.75V
Rohs Compliant
Yes
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
497-4379-5

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ELECTRICAL CHARACTERISTICS (T
ON/OFF
DYNAMIC
SOURCE DRAIN DIODE
Note: 1. Pulsed: Pulse duration = 300 µs, duty cycle 1.5 %.
C
V
Symbol
Symbol
Symbol
I
oss eq.
V
R
V
SDM
(BR)DSS
g
t
t
I
I
I
C
I
SD
GS(th)
DS(on)
C
C
d(on)
d(off)
Q
Q
fs
RRM
RRM
DSS
GSS
I
2. Pulse width limited by safe operating area.
3. C
Q
Q
Q
SD
t
t
oss
t
t
iss
rss
rr
rr
gs
gd
r
f
(1)
g
rr
rr
(1)
V
(2)
DSS
oss eq.
(3)
.
is defined as a constant equivalent capacitance giving the same charging time as C
Drain-source
Breakdown Voltage
Zero Gate Voltage
Drain Current (V
Gate-body Leakage
Current (V
Gate Threshold Voltage
Static Drain-source On
Resistance
Forward Transconductance
Input Capacitance
Output Capacitance
Reverse Transfer
Capacitance
Equivalent Output
Capacitance
Turn-on Delay Time
Rise Time
Turn-off Delay Time
Fall Time
Total Gate Charge
Gate-Source Charge
Gate-Drain Charge
Source-drain Current
Source-drain Current (pulsed)
Forward On Voltage
Reverse Recovery Time
Reverse Recovery Charge
Reverse Recovery Current
Reverse Recovery Time
Reverse Recovery Charge
Reverse Recovery Current
Parameter
Parameter
Parameter
DS
= 0)
GS
= 0)
STP3NK80Z - STF3NK80Z - STD3NK80Z - STD3NK80Z-1
CASE
I
V
V
V
V
V
V
V
V
R
(Resistive Load see, Figure 3)
V
V
I
I
V
(see test circuit, Figure 5)
I
V
(see test circuit, Figure 5)
D
V
SD
SD
SD
DS
DS
GS
DS
GS
DS
GS
DD
DD
GS
DD
DD
G
DS
= 1 mA, V
=25°C UNLESS OTHERWISE SPECIFIED)
= 4.7
= 2.5 A, V
= 2.5 A, di/dt = 100 A/µs
= 2.5 A, di/dt = 100 A/µs
= Max Rating
= Max Rating, T
= V
= 15 V
= ± 20V
= 10V, I
= 0V, V
= 400 V, I
= 640 V, I
= 10 V
= 50 V, T
= 50 V, T
= 25V, f = 1 MHz, V
Test Conditions
Test Conditions
Test Conditions
GS
, I
,
V
DS
I
D
GS
D
GS
D
GS
j
j
D
D
= 1.25 A
= 50 µA
= 1.25 A
= 25°C
= 150°C
= 0V to 640V
= 0
= 10 V
= 1.25 A
= 2.5 A,
= 0
C
= 125 °C
GS
= 0
Min.
Min.
Min.
800
3
oss
when V
1600
2100
Typ.
3.75
Typ.
10.8
Typ.
485
384
474
3.8
2.1
3.2
8.4
8.8
57
22
17
27
36
40
19
11
DS
increases from 0 to 80%
Max.
Max.
Max.
±10
4.5
1.6
4.5
2.5
50
10
1
Unit
Unit
Unit
nC
nC
nC
nC
nC
µA
µA
µA
pF
pF
pF
pF
ns
ns
ns
ns
ns
ns
V
V
S
A
A
V
A
A
3/13

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