GRM155R60J225ME15D Murata Electronics, GRM155R60J225ME15D Datasheet - Page 139

• Manufacturer Part Number: GRM155R60J225ME15D
• Description: Cap Ceramic 2.2uF 6.3VDC X5R 20% SMD 0402 Paper T/R
• Manufacturer: Murata Electronics
• Type: Flatr

Specifications of GRM155R60J225ME15D

• Package/case: 0402
• Mounting: Surface Mount
• Capacitance Value: 2.2 uF
• Dielectric: X5R
• Voltage: 6.3 Vdc
• Product Length: 1 mm
• Product Height: 0.5 mm
• Tolerance: 20 %

!Note
• This PDF catalog is downloaded from the website of Murata Manufacturing co., ltd. Therefore, it’s specifications are subject to change or our products in it may be discontinued without advance notice. Please check with our
• This PDF catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
sales representatives or product engineers before ordering.
!Note
1. Mounting Position
1. Confirm the best mounting position and direction that
2. Information before Mounting
1. Do not reuse capacitors that were removed from the
2. Confirm capacitance characteristics under actual applied
3. Confirm the mechanical stress under actual process and
4. Confirm the rated capacitance, rated voltage and other
3. Maintenance of the Mounting (pick and place) Machine
1. Make sure that the following excessive forces are not
2. Dirt particles and dust accumulated between the suction
!Caution
minimizes the stress imposed on the capacitor during
flexing or bending the printed circuit board.
1-1. Choose a mounting position that minimizes the
equipment.
voltage.
equipment use.
electrical characteristics before assembly.
applied to the capacitors.
1-1. In mounting the capacitors on the printed circuit
nozzle and the cylinder inner wall prevent the nozzle from
moving smoothly. This imposes greater force upon the
chip during mounting, causing cracked chips. Also the
locating claw, when worn out, imposes uneven forces on
the chip when positioning, causing cracked chips. The
suction nozzle and the locating claw must be maintained,
checked and replaced periodically.
Soldering and Mounting
• Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
stress imposed on the chip during flexing or bending
of the board.
board, any bending force against them shall be kept
to a minimum to prevent them from any bending
damage or cracking. Please take into account the
following precautions and recommendations for use
in your process.
(1) Adjust the lowest position of the pickup nozzle so
(2) Adjust the nozzle pressure within a static load of
as not to bend the printed circuit board.
1N to 3N during mounting.
5. Prior to use, confirm the solderability of capacitors that
6. Prior to measuring capacitance, carry out a heat
7. The use of Sn-Zn based solder will deteriorate the
[Component Direction]
[Chip Mounting Close to Board Separation Point]
[Incorrect]
[Correct]
were in long-term storage.
treatment for capacitors that were in long-term storage.
reliability of the MLCC.
Please contact our sales representative or product
engineers on the use of Sn-Zn based solder in advance.
Perforation
Suction Nozzle
A
Board
Slit
B
Support Pin
D
C
Deflection
Continued on the following page.
Chip arrangement
Worst A-C-(B~D) Best
!Caution
Locate chip
horizontal to the
direction in
which stress
acts.
Board Guide
137
C02E.pdf
10.12.20