GRM155R60J225ME15D Murata Electronics, GRM155R60J225ME15D Datasheet - Page 182

• Manufacturer Part Number: GRM155R60J225ME15D
• Description: Cap Ceramic 2.2uF 6.3VDC X5R 20% SMD 0402 Paper T/R
• Manufacturer: Murata Electronics
• Type: Flatr

Specifications of GRM155R60J225ME15D

• Package/case: 0402
• Mounting: Surface Mount
• Capacitance Value: 2.2 uF
• Dielectric: X5R
• Voltage: 6.3 Vdc
• Product Length: 1 mm
• Product Height: 0.5 mm
• Tolerance: 20 %

!Note
• This PDF catalog is downloaded from the website of Murata Manufacturing co., ltd. Therefore, it’s specifications are subject to change or our products in it may be discontinued without advance notice. Please check with our
• This PDF catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
sales representatives or product engineers before ordering.
!Note
No.
12 Deflection
13
14
15
16
* "Room condition" Temperature: 15 to 35D, Relative humidity: 45 to 75%, Atmospheric pressure: 86 to 106kPa
Only for Information Devices Specifications and Test Methods
Continued from the preceding page.
Solderability of
Termination
Resistance
to Soldering
Heat
Temperature
Cycle
Humidity
(Steady
State)
• Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
Item
Appearance
Capacitance
Change
D.F.
I.R.
Dielectric
Strength
Appearance
Capacitance
Change
D.F.
I.R.
Dielectric
Strength
Appearance
Capacitance
Change
D.F.
I.R.
Dielectric
Strength
No marking defects
75% of the terminations are to be soldered evenly and continuously.
No marking defects
Within T10%
0.025 max.
More than 1,000M
In accordance with item No.4
No marking defects
Within T15%
0.05 max.
More than 3,000M
In accordance with item No.4
No marking defects
Within T15%
0.05 max.
More than 1,000M
In accordance with item No.4
4.5Z2.0
4.5Z3.2
5.7Z5.0
LZW
(mm)
3.5
3.5
4.5
a
d
Specifications
100
b
c
a
Fig. 2
Dimension (mm)
7.0
7.0
8.0
b
4.5
t : 1.6
2.4
3.7
5.6
c
GR4 Series Specifications and Test Methods
1.0
d
Solder the capacitor to the testing jig (glass epoxy board) shown
in Fig. 2.
Then apply a force in the direction shown in Fig. 3.
The soldering should be done using the reflow method and
should be conducted with care so that the soldering is uniform
and free of defects such as heat shock.
Immerse the capacitor in a solution of ethanol (JIS-K-8101) and
rosin (JIS-K-5902) (25% rosin in weight proportion).
Immerse in solder solution for 2T0.5 sec.
Immersing speed: 25T2.5mm/s
Temp. of solder: 245T5 C Lead Free Solder (Sn-3.0Ag-0.5Cu)
Preheat the capacitor as in table.
Immerse the capacitor in solder solution at 260T5D for 10T1
sec. Let sit at room condition* for 24T2 hrs., then measure.
#Immersing speed: 25T2.5mm/s
#Pretreatment
*Preheating
Fix the capacitor to the supporting jig (glass epoxy board) shown
in Fig. 4.
Perform the 5 cycles according to the 4 heat treatments listed in
the following table.
Let sit for 24T2 hrs. at room condition,* then measure.
#Pretreatment
Let the capacitor sit at 40T2D and relative humidity of 90 to 95%
for 500
Remove and let sit for 24T2 hrs. at room condition,* then
measure.
#Pretreatment
let sit for 24T2 hrs. at room condition.*
Perform a heat treatment at 150
Perform a heat treatment at 150
let sit for 24T2 hrs. at room condition.*
Perform a heat treatment at 150
let sit for 24T2 hrs. at room condition.*
Step
Step
W24
1
2
1
2
3
4
Y 0
hrs.
Max. Operating Temp.T2
Min. Operating Temp.T3
235T5 C H60A or H63A Eutectic Solder
Glass Epoxy Board
Temperature (D)
R230
Capacitance meter
Temperature
Room Temp.
Room Temp.
100 to 120D
170 to 200D
45
Fig. 3
Fig. 4
Test Method
20 50
45
Continued on the following page.
Pressurize
Pressurizing
speed: 1.0mm/s
W
W
W
Y10
Y10
Y10
0
0
0
Flexure=1
D for 60T5 min. and then
D for 60T5 min. and then
D for 60T5 min. and then
Solder resist
Cu
(in mm)
Time (min.)
1 min.
1 min.
30T3
2 to 3
30T3
2 to 3
Time
181
C02E.pdf
10.12.20