GRM155R60J225ME15D Murata Electronics, GRM155R60J225ME15D Datasheet - Page 213

• Manufacturer Part Number: GRM155R60J225ME15D
• Description: Cap Ceramic 2.2uF 6.3VDC X5R 20% SMD 0402 Paper T/R
• Manufacturer: Murata Electronics
• Type: Flatr

Specifications of GRM155R60J225ME15D

• Package/case: 0402
• Mounting: Surface Mount
• Capacitance Value: 2.2 uF
• Dielectric: X5R
• Voltage: 6.3 Vdc
• Product Length: 1 mm
• Product Height: 0.5 mm
• Tolerance: 20 %

!Note
• This PDF catalog is downloaded from the website of Murata Manufacturing co., ltd. Therefore, it’s specifications are subject to change or our products in it may be discontinued without advance notice. Please check with our
• This PDF catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
sales representatives or product engineers before ordering.
!Note
5. Flow Soldering
Table 2
Recommended Conditions
212
!Caution
Pb-Sn Solder: Sn-37Pb
Lead Free Solder: Sn-3.0Ag-0.5Cu
Peak Temperature
Optimum Solder Amount for Flow Soldering
When components are exposed to sudden heat, their
mechanical strength can be decreased due to the
extreme temperature changes which can cause flexing
and result in internal mechanical damage, which will
cause the parts to fail. Additionally, an excessively long
soldering time or high soldering temperature results in
leaching by the outer electrodes, causing poor adhesion
or a reduction in capacitance value due to loss of contact
between electrodes and end termination.
In order to prevent mechanical damage, preheating is
required for both the components and the PCB board.
Preheating conditions are shown in Table 2. It is required
to keep temperature differential between the soldering
and the components surface ( T) as small as possible.
When components are immersed in solvent after
mounting, be sure to maintain the temperature difference
between the component and solvent within the range
shown in Table 2.
Do not apply flow soldering to chips not listed in Table 2.
The top of the solder fillet should be lower than the
thickness of components. If the solder amount is
excessively large, the risk of cracking is higher during
board bending or under any other stressful conditions.
Continued from the preceding page.
Atmosphere
• Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
G--18/21/31
Part Number
Pb-Sn Solder
240-250 C
Air
Temperature Differential
TV150D
Lead Free Solder
250-260 C
N
2
[Standard Conditions for Flow Soldering]
[Allowable Soldering Temperature and Time]
Peak Temperature
Temperature (D)
In the case of repeated soldering, the accumulated
soldering time must be within the range shown above.
270
260
250
240
230


















170 C
150 C
130 C
0












 

Adhesive
T
10
60-120 seconds
Preheating
20
Continued on the following page.
Soldering
5 seconds max.
Soldering Time (sec.)
30
Up to Chip Thickness
Gradual
Cooling
Time
in section
C02E.pdf
10.12.20