GRM155R60J225ME15D Murata Electronics, GRM155R60J225ME15D Datasheet - Page 190

• Manufacturer Part Number: GRM155R60J225ME15D
• Description: Cap Ceramic 2.2uF 6.3VDC X5R 20% SMD 0402 Paper T/R
• Manufacturer: Murata Electronics
• Type: Flatr

Specifications of GRM155R60J225ME15D

• Package/case: 0402
• Mounting: Surface Mount
• Capacitance Value: 2.2 uF
• Dielectric: X5R
• Voltage: 6.3 Vdc
• Product Length: 1 mm
• Product Height: 0.5 mm
• Tolerance: 20 %

!Note
• This PDF catalog is downloaded from the website of Murata Manufacturing co., ltd. Therefore, it’s specifications are subject to change or our products in it may be discontinued without advance notice. Please check with our
• This PDF catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
sales representatives or product engineers before ordering.
!Note
No.
12 Deflection
13
14
15
16
* "Room condition" Temperature: 15 to 35D, Relative humidity: 45 to 75%, Atmospheric pressure: 86 to 106kPa
AC250V(r.m.s.) Type (Which Meet Japanese Law) Specifications and Test Methods
Continued from the preceding page.
Solderability of
Termination
Humidity
Insulation
Resistance
to Soldering
Heat
Temperature
Cycle
• Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
• This catalog has only typical specifications because there is no space for detailed specifications. Therefore, please approve our product specifications or transact the approval sheet for product specifications before ordering.
Item
Appearance
Capacitance
Change
D.F.
I.R.
Dielectric
Strength
Appearance
Capacitance
Change
D.F.
I.R.
Dielectric
Strength
Appearance
Capacitance
Change
D.F.
I.R.
Dielectric
Strength
No marking defects
75% of the terminations are to be soldered evenly and continuously.
No marking defects
Within T15%
0.05 max.
More than 1,000M
In accordance with item No.4
No marking defects
Within T10%
0.025 max.
More than 2,000M
In accordance with item No.4
No marking defects
Within T15%
0.05 max.
More than 2,000M
In accordance with item No.4
4.5Z2.0
4.5Z3.2
5.7Z5.0
LZW
(mm)
3.5
3.5
4.5
a
d
Specifications
100
b
a
c
Fig. 2
Dimension (mm)
7.0
7.0
8.0
b
4.5
t : 1.6
2.4
3.7
5.6
c
GA2 Series Specifications and Test Methods
1.0
d
Solder the capacitor to the testing jig (glass epoxy board) shown
in Fig. 2.
Then apply a force in the direction shown in Fig. 3. The soldering
should be done using the reflow method and should be
conducted with care so that the soldering is uniform and free of
defects such as heat shock.
Immerse the capacitor in a solution of ethanol (JIS-K-8101) and
rosin (JIS-K-5902) (25% rosin in weight proportion).
Immerse in solder solution for 2T0.5 sec.
Immersing speed: 25T2.5mm/s
Temp. of solder: 245T5 C Lead Free Solder (Sn-3.0Ag-0.5Cu)
The capacitor should be subjected to 40T2D, relative humidity of
90 to 98% for 8 hrs., and then removed in room condition* for 16
hrs. until 5 cycles.
Preheat the capacitor as in table.
Immerse the capacitor in solder solution at 260T5D for 10T1
sec. Let sit at room condition* for 24T2 hrs., then measure.
#Immersing speed: 25T2.5mm/s
#Pretreatment
*Preheating
Fix the capacitor to the supporting jig (glass epoxy board) shown
in Fig. 4.
Perform the 5 cycles according to the 4 heat treatments listed in
the following table.
Let sit for 24T2 hrs. at room condition,* then measure.
#Pretreatment
Perform a heat treatment at 150
let sit for 24T2 hrs. at room condition.*
Perform a heat treatment at 150
let sit for 24T2 hrs. at room condition.*
Step
Step
1
2
1
2
3
4
Max. Operating Temp.T2
Min. Operating Temp.T3
235T5 C H60A or H63A Eutectic Solder
Glass Epoxy Board
Temperature (D)
R230
Capacitance meter
Temperature
Room Temp.
Room Temp.
100 to 120D
170 to 200D
45
Test Method
20 50
Fig. 3
Fig. 4
45
Continued on the following page.
Pressurize
Pressurizing
speed: 1.0mm/s
W
Y10
W
Y10
0
0
Flexure=1
D for 60T5 min. and then
D for 60T5 min. and then
Solder resist
Cu
(in mm)
Time (min.)
1 min.
1 min.
30T3
2 to 3
30T3
2 to 3
Time
189
C02E.pdf
10.12.20