ON5250,135 NXP Semiconductors, ON5250,135 Datasheet - Page 19

• Manufacturer Part Number: ON5250,135
• Description: MOSFET RF SOT223 SC-73
• Manufacturer: NXP Semiconductors

Specifications of ON5250,135

• Package / Case: SOT-223 (3 leads + Tab), SC-73, TO-261
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Current Rating: -
• Power - Output: -
• Frequency: -
• Gain: -
• Transistor Type: -
• Noise Figure: -
• Current - Test: -
• Voltage - Test: -
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Lead free / RoHS Compliant
• Other names: 934057275135

Philips Semiconductors
SOLDERING
Introduction to soldering through-hole mount
packages
This text gives a brief insight to wave, dip and manual
soldering. A more in-depth account of soldering ICs can be
found in our “Data Handbook IC26; Integrated Circuit
Packages” (document order number 9398 652 90011).
Wave soldering is the preferred method for mounting of
through-hole mount IC packages on a printed-circuit
board.
Soldering by dipping or by solder wave
The maximum permissible temperature of the solder is
260 C; solder at this temperature must not be in contact
with the joints for more than 5 seconds.
The total contact time of successive solder waves must not
exceed 5 seconds.
Suitability of through-hole mount IC packages for dipping and wave soldering methods
Note
1. For SDIP packages, the longitudinal axis must be parallel to the transport direction of the printed-circuit board.
2002 Aug 23
DBS, DIP, HDIP, SDIP, SIL
GreenChip
PACKAGE
TM
II SMPS control IC
suitable
DIPPING
19
The device may be mounted up to the seating plane, but
the temperature of the plastic body must not exceed the
specified maximum storage temperature (T
printed-circuit board has been pre-heated, forced cooling
may be necessary immediately after soldering to keep the
temperature within the permissible limit.
Manual soldering
Apply the soldering iron (24 V or less) to the lead(s) of the
package, either below the seating plane or not more than
2 mm above it. If the temperature of the soldering iron bit
is less than 300 C it may remain in contact for up to
10 seconds. If the bit temperature is between
300 and 400 C, contact may be up to 5 seconds.
SOLDERING METHOD
TEA1533P; TEA1533AP
suitable
(1)
WAVE
Product specification
stg(max)
). If the