MT48LC32M8A2TG-75:D Micron Technology Inc, MT48LC32M8A2TG-75:D Datasheet - Page 20
![no-image](/images/manufacturer_photos/0/4/441/micron_technology_inc_sml.jpg)
MT48LC32M8A2TG-75:D
Manufacturer Part Number
MT48LC32M8A2TG-75:D
Description
DRAM Chip SDRAM 256M-Bit 32Mx8 3.3V 54-Pin TSOP-II Tray
Manufacturer
Micron Technology Inc
Type
SDRAMr
Datasheet
1.MT48LC32M8A2TG-75D.pdf
(87 pages)
Specifications of MT48LC32M8A2TG-75:D
Density
256 Mb
Maximum Clock Rate
133 MHz
Package
54TSOP-II
Address Bus Width
15 Bit
Operating Supply Voltage
3.3 V
Maximum Random Access Time
6|5.4 ns
Operating Temperature
0 to 70 °C
Organization
32Mx8
Address Bus
15b
Access Time (max)
6/5.4ns
Operating Supply Voltage (typ)
3.3V
Package Type
TSOP-II
Operating Temp Range
0C to 70C
Operating Supply Voltage (max)
3.6V
Operating Supply Voltage (min)
3V
Supply Current
135mA
Pin Count
54
Mounting
Surface Mount
Operating Temperature Classification
Commercial
Lead Free Status / RoHS Status
Not Compliant
- Current page: 20 of 87
- Download datasheet (4Mb)
Figure 11: Example: Temperature Test Point Location, 54-Ball VFBGA (Top View)
Figure 12: Example: Temperature Test Point Location, 60-Ball FBGA (Top View)
PDF: 09005aef8091e6d1
256Mb_sdr.pdf - Rev. N 1/10 EN
Test point
Test point
4.00mm
4.00mm
8.00mm
8.00mm
20
Temperature and Thermal Impedance
8.00mm
Micron Technology, Inc. reserves the right to change products or specifications without notice.
7.00mm
14.00mm
16.00mm
256Mb: x4, x8, x16 SDRAM
© 1999 Micron Technology, Inc. All rights reserved.
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