M25P40-VMP6GB NUMONYX, M25P40-VMP6GB Datasheet - Page 5

• Manufacturer Part Number: M25P40-VMP6GB
• Description: Flash Mem Serial-SPI 2.5V/3.3V 4M-Bit 512K x 8 8ns 8-Pin VFQFPN EP Tray
• Manufacturer: NUMONYX

Specifications of M25P40-VMP6GB

• Package: 8VFQFPN EP
• Cell Type: NOR
• Density: 4 Mb
• Architecture: Sectored
• Block Organization: Symmetrical
• Typical Operating Supply Voltage: 2.5|3.3 V
• Sector Size: 64KByte x 8
• Timing Type: Synchronous
• Operating Temperature: -40 to 85 °C
• Interface Type: Serial-SPI

List of figures
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4 x 3 mm package mechanical data52
Figure 31.
2 x 3 mm package outline54
Logic diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
Hold timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 47
SO and MLP8 connections . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Bus Master and memory devices on the SPI bus . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
SPI modes supported . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Hold condition activation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Write Enable (WREN) instruction sequence . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
Write Disable (WRDI) instruction sequence . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
Read Identification (RDID) instruction sequence and data-out sequence . . . . . . . . . . . . . 22
Read Status Register (RDSR) instruction sequence and data-out sequence . . . . . . . . . . 23
Write Status Register (WRSR) instruction sequence . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
Read Data Bytes (READ) instruction sequence and data-out sequence . . . . . . . . . . . . . . 26
Read Data Bytes at Higher Speed (FAST_READ) instruction sequence
and data-out sequence . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28
Page Program (PP) instruction sequence . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
Sector Erase (SE) instruction sequence . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30
Bulk Erase (BE) instruction sequence . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31
Deep Power-down (DP) instruction sequence . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32
Release from Deep Power-down and Read Electronic Signature (RES) instruction
sequence and data-out sequence . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34
Release from Deep Power-down instruction sequence . . . . . . . . . . . . . . . . . . . . . . . . . . . 34
Power-up timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36
AC measurement I/O waveform . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41
Serial input timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 46
Write Protect setup and hold timing during WRSR when SRWD = 1 . . . . . . . . . . . . . . . . . 46
Output timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 47
SO8 narrow – 8 lead plastic Small Outline, 150 mils body width, package outline. . . . . . . 48
SO8W – 8 lead plastic small outline, 208 mils body width, package outline. . . . . . . . . . . . 49
DFN8 (MLP8) 8-lead, dual flat package no lead, 6 × 5 mm, package outline . . . . . . . . . . 50
VFDFPN8 (MLP8) 8-lead Very thin Fine pitch Quad Flat Package No lead,
6 × 5 mm, package outline . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 51
UFDFPN8 (MLP8) 8-lead ultra thin fine pitch dual flat package no lead,
UFDFPN8 (MLP8) 8-lead ultra thin fine pitch dual flat package no lead,
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