107314676 Lineage Power, 107314676 Datasheet - Page 12
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107314676
Manufacturer Part Number
107314676
Description
Module DC-DC 1-OUT 15V 3.33A 50W 9-Pin
Manufacturer
Lineage Power
Type
Step Downr
Datasheet
1.JC050C1.pdf
(16 pages)
Specifications of 107314676
Output Current
3.33 A
Output Voltage
15 V
Input Voltage
28 V
Number Of Outputs
1
Output Power
50 W
JC050C, JC075C, JC100C Power Modules: dc-dc Converters;
18 Vdc to 36 Vdc Input, 15 Vdc Output; 50 W to 100 W
12
12
Thermal considerations
Heat Transfer Without Heat Sinks
Figure 23. JC100C Power Dissipation vs.
Heat Transfer with Heat Sinks
The power modules have through-threaded, M3 x 0.5
mounting holes, which enable heat sinks or cold plates
to attach to the module. The mounting torque must not
exceed 0.56 N-m (5 in.-lb.). For a screw attachment
from the pin side, the recommended hole size on the
customer’s PWB around the mounting holes is
0.130 ± 0.005 inches. If a larger hole is used, the
mounting torque from the pin side must not exceed
0.25 N-m (2.2 in.-lbs.).
Thermal derating with heat sinks is expressed by using
the overall thermal resistance of the module. Total
module thermal resistance (θca) is defined as the max-
imum case temperature rise (ΔT
module power dissipation (P
The location to measure case temperature (T
shown in Figure 20. Case-to-ambient thermal resis-
tance vs. airflow is shown, for various heat sink config-
urations and heights, in Figure 24. These curves were
obtained by experimental testing of heat sinks, which
are offered in the product catalog.
θ
18
16
14
12
10
ca
8
6
4
2
0
0
=
Output Current
ΔT
-------------------- -
1
P
C max
,
V
V
V
D
I
I
I
= 18 V
= 28 V
= 36 V
OUTPUT CURRENT, I
2
=
3
(
----------------------- -
T
D
C
):
P
–
D
C, max
T
4
A
(continued)
)
O
) divided by the
(A)
5
(continued)
6
C
) is
8-1584 (C)
7
Figure 24. Case-to-Ambient Thermal Resistance
These measured resistances are from heat transfer
from the sides and bottom of the module as well as the
top side with the attached heat sink; therefore, the
case-to-ambient thermal resistances shown are gener-
ally lower than the resistance of the heat sink by itself.
The module used to collect the data in Figure 24 had a
thermal-conductive dry pad between the case and the
heat sink to minimize contact resistance. The use of
Figure 24 is shown in the following example
Example
If an 85 °C case temperature is desired, what is the
minimum airflow necessary? Assume the JC100C
module is operating at nominal line and an output cur-
rent of 6 A, maximum ambient air temperature of
40 °C, and the heat sink is 0.5 in.
8
7
6
5
4
3
2
1
0
0
Curves; Either Orientation
AIR VELOCITY MEASURED IN m/s (ft./min.)
(100)
0.5
(200)
1.0
(300)
1.5
Lineage Power
March 2008
1 1/2 IN HEAT SINK
1 IN HEAT SINK
1/2 IN HEAT SINK
1/4 IN HEAT SINK
NO HEAT SINK
Data Sheet
(400)
2.0
(500)
2.5
(600)
3.0
8-1153