PUMH30,115 NXP Semiconductors, PUMH30,115 Datasheet - Page 3

TRANS NPN/NPN W/RES 50V SOT-363

PUMH30,115

Manufacturer Part Number
PUMH30,115
Description
TRANS NPN/NPN W/RES 50V SOT-363
Manufacturer
NXP Semiconductors
Datasheet

Specifications of PUMH30,115

Package / Case
SC-70-6, SC-88, SOT-363
Transistor Type
2 NPN - Pre-Biased (Dual)
Current - Collector (ic) (max)
100mA
Voltage - Collector Emitter Breakdown (max)
50V
Resistor - Base (r1) (ohms)
2.2K
Dc Current Gain (hfe) (min) @ Ic, Vce
30 @ 20mA, 5V
Vce Saturation (max) @ Ib, Ic
150mV @ 500µA, 10mA
Current - Collector Cutoff (max)
1µA
Power - Max
300mW
Mounting Type
Surface Mount
Configuration
Dual
Transistor Polarity
NPN
Typical Input Resistor
2.2 KOhm
Mounting Style
SMD/SMT
Collector- Emitter Voltage Vceo Max
50 V
Peak Dc Collector Current
100 mA
Maximum Operating Temperature
+ 150 C
Minimum Operating Temperature
- 65 C
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Frequency - Transition
-
Resistor - Emitter Base (r2) (ohms)
-
Lead Free Status / RoHS Status
Lead free / RoHS Compliant, Lead free / RoHS Compliant
Other names
934059932115
PUMH30 T/R
PUMH30 T/R

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
PUMH30,115
Manufacturer:
NXP
Quantity:
21 400
Part Number:
PUMH30,115
Manufacturer:
NEXPERIA/安世
Quantity:
20 000
Philips Semiconductors
5. Limiting values
6. Thermal characteristics
PEMH30_PUMH30_1
Product data sheet
Table 6.
In accordance with the Absolute Maximum Rating System (IEC 60134).
[1]
[2]
Table 7.
[1]
[2]
Symbol
Per transistor
V
V
V
I
I
P
Per device
P
T
T
T
Symbol
Per transistor
R
Per device
R
O
CM
j
amb
stg
CBO
CEO
EBO
tot
tot
th(j-a)
th(j-a)
Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard
footprint.
Reflow soldering is the only recommended soldering method.
Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint.
Reflow soldering is the only recommended soldering method.
Limiting values
Thermal characteristics
Parameter
thermal resistance from
junction to ambient
thermal resistance from
junction to ambient
Parameter
collector-base voltage
collector-emitter voltage
emitter-base voltage
output current
peak collector current
total power dissipation
total power dissipation
junction temperature
ambient temperature
storage temperature
NPN/NPN double resistor-equipped transistors; R1 = 2.2 k , R2 = open
SOT363
SOT666
SOT363
SOT666
SOT363
SOT666
SOT363
SOT666
Rev. 01 — 28 March 2006
Conditions
open emitter
open base
open collector
single pulse;
t
T
T
p
Conditions
in free air
in free air
amb
amb
1 ms
25 C
25 C
PEMH30; PUMH30
[1][2]
[1][2]
[1]
[1]
[1][2]
[1][2]
© Koninklijke Philips Electronics N.V. 2006. All rights reserved.
[1]
[1]
Min
-
-
-
-
Min
-
-
-
-
-
-
-
-
-
-
65
65
Typ
-
-
-
-
Max
50
50
5
100
100
200
200
300
300
150
+150
+150
Max
625
625
416
416
Unit
V
V
V
mA
mA
mW
mW
mW
mW
Unit
K/W
K/W
K/W
K/W
C
C
C
3 of 10

Related parts for PUMH30,115