MMBT5089LT1G ON Semiconductor, MMBT5089LT1G Datasheet

MMBT5089LT1G

Manufacturer Part Number

MMBT5089LT1G

Description

TRANS GP SS NPN 25V LN SOT23

Manufacturer

ON Semiconductor

Datasheet

1.MMBT5088LT1G.pdf (5 pages)

Specifications of MMBT5089LT1G

Transistor Type

NPN

Current - Collector (ic) (max)

50mA

Voltage - Collector Emitter Breakdown (max)

25V

Vce Saturation (max) @ Ib, Ic

500mV @ 1mA, 10mA

Dc Current Gain (hfe) (min) @ Ic, Vce

300 @ 100µA, 5V

Power - Max

225mW

Frequency - Transition

50MHz

Mounting Type

Surface Mount

Package / Case

SOT-23-3, TO-236-3, Micro3™, SSD3, SST3

Configuration

Single

Transistor Polarity

NPN

Mounting Style

SMD/SMT

Collector- Emitter Voltage Vceo Max

25 V

Emitter- Base Voltage Vebo

4.5 V

Continuous Collector Current

0.05 A

Maximum Dc Collector Current

0.05 A

Power Dissipation

225 mW

Maximum Operating Frequency

50 MHz

Maximum Operating Temperature

+ 150 C

Dc Collector/base Gain Hfe Min

400 at 0.1 mA at 5 V

Minimum Operating Temperature

- 55 C

Number Of Elements

Collector-emitter Voltage

25V

Collector-base Voltage

30V

Emitter-base Voltage

4.5V

Collector Current (dc) (max)

50mA

Dc Current Gain (min)

400

Frequency (max)

50MHz

Operating Temp Range

-55C to 150C

Operating Temperature Classification

Military

Mounting

Surface Mount

Pin Count

Package Type

SOT-23

Lead Free Status / RoHS Status

Lead free / RoHS Compliant

Current - Collector Cutoff (max)

Lead Free Status / Rohs Status

Lead free / RoHS Compliant

Other names

MMBT5089LT1GOS
MMBT5089LT1GOS
MMBT5089LT1GOSTR

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MMBT5088LT1G,

MMBT5089LT1G

Low Noise Transistors

NPN Silicon

Features

•

Stresses exceeding Maximum Ratings may damage the device. Maximum

Ratings are stress ratings only. Functional operation above the Recommended

Operating Conditions is not implied. Extended exposure to stresses above the

Recommended Operating Conditions may affect device reliability.

1. FR−5 = 1.0 x 0.75 x 0.062 in.

2. Alumina = 0.4 x 0.3 x 0.024 in. 99.5% alumina.

August, 2009 − Rev. 3

MAXIMUM RATINGS

THERMAL CHARACTERISTICS

Collector −Emitter Voltage

Collector −Base Voltage

Emitter−Base Voltage

Collector Current − Continuous

Total Device Dissipation FR−5 Board,

Thermal Resistance, Junction−to−Ambient

Total Device Dissipation Alumina

Thermal Resistance, Junction−to−Ambient

Junction and Storage Temperature

Compliant

These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS

(Note 1) T

Derate above 25°C

Substrate, (Note 2) T

Derate above 25°C

Characteristic

= 25°C

Rating

= 25°C

MMBT5088

MMBT5089

MMBT5088

MMBT5089

Symbol

CEO

CBO

EBO

, T

qJA

stg

−55 to +150

Value

Max

225

556

300

417

4.5

1.8

2.4

mW/°C

mAdc

°C/W

Unit

Vdc

°C

†For information on tape and reel specifications,

MMBT5088LT1G

MMBT5089LT1G

including part orientation and tape sizes, please

refer to our Tape and Reel Packaging Specifications

Brochure, BRD8011/D.

*Date Code orientation and/or overbar may

Device

vary depending upon manufacturing location.

(Note: Microdot may be in either location)

1x = Device Code

ORDERING INFORMATION

MARKING DIAGRAM

BASE

= Date Code*

= Pb−Free Package

http://onsemi.com

x = Q for MMBT5088LT1

x = R for MMBT5089LT1

(Pb−Free)

Package

SOT−23

1x M G

COLLECTOR

EMITTER

Publication Order Number:

SOT−23 (TO−236)

CASE 318

STYLE 6

3,000 / Tape & Reel

MMBT5088LT1/D

Shipping

†

Related parts for MMBT5089LT1G

MMBT5089LT1G Summary of contents

Page 1

... R 417 °C/W qJA −55 to +150 °C J stg MMBT5088LT1G MMBT5089LT1G †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. 1 http://onsemi.com COLLECTOR 3 1 BASE 2 EMITTER 3 SOT−23 (TO−236) ...

Page 2

ELECTRICAL CHARACTERISTICS (T Characteristic OFF CHARACTERISTICS Collector −Emitter Breakdown Voltage (I = 1.0 mAdc Collector −Base Breakdown Voltage (I = 100 mAdc Collector Cutoff Current ( Vdc, I ...

Page 3

BANDWIDTH = 1 ≈ 3 1.0 mA 7.0 5.0 300 mA 3 100 200 500 ...

Page 4

2.0 1.0 0.7 0.5 0.4 0.3 0.2 0.01 0.02 0.03 0.05 1 25°C J 0 0.4 0 ...

Page 5

... A A1 *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “ ...

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