BGF802-20 NXP Semiconductors, BGF802-20 Datasheet
BGF802-20
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BGF802-20 Summary of contents
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... DISCRETE SEMICONDUCTORS DATA SHEET M3D737 BGF802-20 CDMA800 power module Product specification Supersedes data of 2003 Jun 13 2005 Jun 03 ...
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... ACPR 750 kHz at 30 kHz resolution bandwidth. 3. ACPR 1.98 MHz at 30 kHz resolution bandwidth. 4. ACPR 400 kHz at 30 kHz resolution bandwidth. 2005 Jun 03 PINNING - SOT365C (MHz) (V) ( 2.5 2 Product specification BGF802-20 PIN DESCRIPTION 1 RF input output Flange ground Top view MBL257 Fig.1 Simplified outline. G ACPR p (dB) ...
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... L CONDITIONS gain compression small signal dBm; D 894 MHz < f < 869 MHz VSWR through all phases VSWR = through all phases Product specification BGF802-20 MIN. MAX. 30 100 30 40 +100 20 +90 unless otherwise specified. MIN. TYP. MAX. 245 280 320 0.2 1 0.8 ...
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... Fig.3 MBL764 30.4 handbook, halfpage G p (dB) 30 29.6 29.2 28.8 28 (AV) ( 882 MHz. Fig.5 4 Product specification BGF802- (AV) (W) ACPR at 750 kHz as a function of output power; typical values (W) CW power gain and efficiency as functions of load power; typical values. MBL763 8 MBL765 60 (%) ...
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... Jun 03 MBL766 48 handbook, halfpage d im (dBc) (%) (AV) ( 882 MHz Fig.7 MBL768 handbook, halfpage EVM rms (%) (AV) ( 882 MHz. Fig.9 5 Product specification BGF802- (AV) (W) = 883 MHz. 2 Two tone intermodulation distortion as function of load power; typical values GSM EDGE rms EVM as a function of load power ...
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... CDMA800 power module 12 handbook, halfpage EVM M (%) 882 MHz. Fig.10 GSM EDGE peak EVM as a function of load power; typical values. 2005 Jun 03 MBL770 handbook, halfpage s 21 (dB (AV) (W) Fig.11 s-parameters as a function of frequency. 6 Product specification BGF802- 750 850 950 f (MHz) MBL771 (dB 1050 ...
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... The RF input and output of the module are designed for 50 connections. Incoming inspection When incoming inspection is performed, use a properly designed test fixture to avoid excessive mechanical stress and to ensure optimal RF performance. Philips can deliver dedicated test fixtures on request. 7 Product specification BGF802-20 ...
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... Ferroxcube bead R1 metal film resistor stripline; note Note 1. The striplines are on a double copper-clad printed-circuit board (RO5880) with 2005 Jun output DESCRIPTION 8 Product specification BGF802-20 CATALOGUE VALUE NUMBER 100 nF 100 4330 030 36300 10 ; 0.4 W 2322 195 13109 50 = 2.2 and thickness = 0.79 mm. r ...
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... Philips Semiconductors CDMA800 power module handbook, full pagewidth output 50 Dimensions in mm. 2005 Jun DUT Fig.13 Printed-circuit board and component layout. 9 Product specification BGF802-20 42 input MBL780 ...
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... 4.0 3.3 3.7 3.55 2.54 20.32 3.8 3.1 3.3 3.45 REFERENCES JEDEC JEITA 48.4 15.4 7.75 1.1 41.75 0.3 0.25 48.0 15.2 7.55 0.0 41.65 EUROPEAN PROJECTION Product specification BGF802-20 SOT365C 12.8 0.1 12.6 ISSUE DATE 01-06-06 02-11-13 ...
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... Product specification BGF802-20 DEFINITION These products are not Philips Semiconductors ...
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Philips Semiconductors – a worldwide company Contact information For additional information please visit http://www.semiconductors.philips.com. For sales offices addresses send e-mail to: sales.addresses@www.semiconductors.philips.com. © Koninklijke Philips Electronics N.V. 2005 All rights are reserved. Reproduction in whole or in part is prohibited ...