MD1803DFP STMicroelectronics, MD1803DFP Datasheet
MD1803DFP
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MD1803DFP Summary of contents
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... Integrated free wheeling diode Applications ■ Horizontal deflection output for TV Description The MD1803DFP is manufactured using diffused collector in planar technology adopting new and enhanced high voltage structure. The new MD product series show improved silicon efficiency bringing updated performance to the horizontal deflection stage. ...
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... Insulation withstand voltage (rms) from all three leads to V isol external heatsink T Storage temperature stg T Max. operating junction temperature J Table 3. Thermal data Symbol R Thermal resistance junction-case thj-case 2/10 Parameter = < 5ms 25°C c Parameter ___________ ____max MD1803DFP Value Unit 1500 V 700 1500 V -65 to 150 °C 150 °C Value Unit 3.125 °C/W ...
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... MD1803DFP 2 Electrical characteristics (T = 25°C; unless otherwise specified) CASE Electrical characteristics Table 4. Symbol Parameter Collector cut-off current I CES ( Emitter cut-off current I EBO ( Emitter-base breakdown voltage V (BR)EBO ( Collector-emitter saturation (1) V CE(sat) voltage (1) V Base-emitter saturation voltage BE(sat) ( current gain FE V Diode forward voltage ...
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... Electrical characteristics 2.1 Electrical characteristics (curve) Figure 2. Safe operating area Figure 4. Output characteristics 4/10 Figure 3. Derating curve Figure 5. Reverse biased SOA MD1803DFP ...
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... MD1803DFP Figure 6. DC current gain Figure 8. Collector-emitter saturation voltage Figure 9. Figure 10. Power losses Figure 7. DC current gain Base-emitter saturation voltage Figure 11. Inductive load switching time Electrical characteristics 5/10 ...
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... Test circuit 3 Test circuit Figure 12. Power losses and inductive load switching test circuit Figure 13. Reverse biased safe operating area test circuit 6/10 MD1803DFP ...
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... MD1803DFP 4 Package mechanical data In order to meet environmental requirements, ST offers these devices in ECOPACK® packages. These packages have a lead-free second level interconnect . The category of second level interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label ...
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... Dia MD1803DFP inch Min. Typ. Max. 0.173 0.181 0.098 0.106 0.098 0.108 0.017 0.027 0.030 0.039 0.045 0.067 0.045 0.067 0.195 0.204 0.094 0.106 ...
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... MD1803DFP 5 Revision history Table 5. Document revision history Date 27-May-2008 Revision 1 First release Revision history Changes 9/10 ...
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... Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan - Malaysia - Malta - Morocco - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America 10/10 Please Read Carefully: © 2008 STMicroelectronics - All rights reserved STMicroelectronics group of companies www.st.com MD1803DFP ...