MT46V32M8P-5B:K Micron Technology Inc, MT46V32M8P-5B:K Datasheet - Page 16

DRAM Chip DDR SDRAM 256M-Bit 32Mx8 2.6V 66-Pin TSOP Tray

MT46V32M8P-5B:K

Manufacturer Part Number
MT46V32M8P-5B:K
Description
DRAM Chip DDR SDRAM 256M-Bit 32Mx8 2.6V 66-Pin TSOP Tray
Manufacturer
Micron Technology Inc
Type
DDR SDRAMr
Datasheet

Specifications of MT46V32M8P-5B:K

Density
256 Mb
Maximum Clock Rate
400 MHz
Package
66TSOP
Address Bus Width
15 Bit
Operating Supply Voltage
2.6 V
Maximum Random Access Time
0.7 ns
Operating Temperature
0 to 70 °C
Organization
32Mx8
Address Bus
15b
Access Time (max)
700ps
Operating Supply Voltage (typ)
2.6V
Package Type
TSOP
Operating Temp Range
0C to 70C
Operating Supply Voltage (max)
2.7V
Operating Supply Voltage (min)
2.5V
Supply Current
200mA
Pin Count
66
Mounting
Surface Mount
Operating Temperature Classification
Commercial
Lead Free Status / RoHS Status
Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
MT46V32M8P-5B:K
Manufacturer:
TI
Quantity:
7 600
Figure 10:
PDF: 09005aef80768abb/Source: 09005aef82a95a3a
256Mb_DDR_x4x8x16_D2.fm - 256Mb DDR: Rev. O, Core DDR: Rev. B 1/09 EN
Solder ball material:
eutectic or SAC305.
Dimensions apply
to solder balls post-
reflow on Ø0.33
NSMD ball pads.
Seating
60X Ø0.45
plane
0.12 A
11 CTR
60-Ball FBGA (8mm x 12.5mm)
Notes:
1 TYP
A
1. Package only available in Die Revision K.
3. Topside part marking decoder can be found on Micron’s Web site.
2. All dimensions are in millimeters.
9 8 7
0.8 TYP
6.4 CTR
8 ±0.15
3 2 1
1
A
B
C
D
E
F
G
H
J
K
L
M
0.8 ±0.1
16
Ball A1 ID
12.5 ±0.15
Micron Technology, Inc., reserves the right to change products or specifications without notice.
256Mb: x4, x8, x16 DDR SDRAM
0.25 MIN
1.20 MAX
Package Dimensions
©2003 Micron Technology, Inc. All rights reserved.
Ball A1 ID

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