MT47H128M8CF-3:H Micron Technology Inc, MT47H128M8CF-3:H Datasheet - Page 19

• Manufacturer Part Number: MT47H128M8CF-3:H
• Description: DRAM Chip DDR2 SDRAM 1G-Bit 128Mx8 1.8V 60-Pin FBGA Tray
• Manufacturer: Micron Technology Inc
• Type: DDR2 SDRAMr
• Series: -r

Specifications of MT47H128M8CF-3:H

• Density: 1 Gb
• Maximum Clock Rate: 667 MHz
• Package: 60FBGA
• Address Bus Width: 17 Bit
• Operating Supply Voltage: 1.8 V
• Maximum Random Access Time: 0.45 ns
• Operating Temperature: 0 to 85 °C
• Organization: 128Mx8
• Address Bus: 17b
• Access Time (max): 450ps
• Operating Supply Voltage (typ): 1.8V
• Package Type: FBGA
• Operating Temp Range: 0C to 85C
• Operating Supply Voltage (max): 1.9V
• Operating Supply Voltage (min): 1.7V
• Supply Current: 115mA
• Pin Count: 60
• Mounting: Surface Mount
• Operating Temperature Classification: Commercial
• Format - Memory: RAM
• Memory Type: DDR2 SDRAM
• Memory Size: 1G (128M x 8)
• Speed: 3ns
• Interface: Parallel
• Voltage - Supply: 1.7 V ~ 1.9 V
• Package / Case: 60-TFBGA
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

Packaging
Package Dimensions
Figure 8: 84-Ball FBGA Package (8mm x 12.5mm) – x16
PDF: 09005aef821ae8bf
1GbDDR2.pdf – Rev. V 6/10 EN
12.5 ±0.1
84X Ø0.45
Dimensions apply
to solder balls
post-reflow on
Ø0.35 SMD ball pads.
11.2 CTR
0.155
0.8 TYP
Notes:
9
1. All dimensions are in millimeters.
2. Solder ball material: SAC305 (96.5% Sn, 3% Ag, 0.5% Cu) or leaded Eutectic (62% Sn,
8
Nonconductive
36%Pb, 2% Ag).
7
overmold
6.4 CTR
1.8 CTR
8 ±0.1
0.8 TYP
3
2
1
B
C
D
E
F
G
H
J
K
L
M
N
P
R
A
19
A
Ball A1 ID
Exposed gold plated pad
1.0 MAX X 0.7 nominal.
Micron Technology, Inc. reserves the right to change products or specifications without notice.
Seating plane
0.12 A
1Gb: x4, x8, x16 DDR2 SDRAM
0.25 MIN
1.1 ±0.1
© 2004 Micron Technology, Inc. All rights reserved.
Ball A1 ID
Packaging