Z0103NN,135 NXP Semiconductors, Z0103NN,135 Datasheet - Page 6

• Manufacturer Part Number: Z0103NN,135
• Description: TRIAC 800V 1A SOT-223
• Manufacturer: NXP Semiconductors

Specifications of Z0103NN,135

• Package / Case: TO-261-4, TO-261AA
• Triac Type: Logic - Sensitive Gate
• Mounting Type: Surface Mount
• Configuration: Single
• Current - Hold (ih) (max): 7mA
• Voltage - Off State: 800V
• Current - Gate Trigger (igt) (max): 3mA
• Current - Non Rep. Surge 50, 60hz (itsm): 8A, 8.5A
• Current - On State (it (rms)) (max): 1A
• Voltage - Gate Trigger (vgt) (max): 1.3V
• Current - On State (it (rms) (max): 1A
• Rated Repetitive Off-state Voltage Vdrm: 800 V
• Breakover Current Ibo Max: 8.5 A
• Off-state Leakage Current @ Vdrm Idrm: 0.5 mA
• Gate Trigger Voltage (vgt): 1.3 V
• Gate Trigger Current (igt): 5 mA
• Holding Current (ih Max): 7 mA
• Forward Voltage Drop: 1.6 V
• Mounting Style: SMD/SMT
• Repetitive Peak Forward Blocking Voltage: 800 V
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: 568-2194-2; 934057055135; Z0103NN /T3

NXP Semiconductors
5. Thermal characteristics
Table 5.
Z0103NN
Product data sheet
Symbol
R
R
Fig 6.
th(j-sp)
th(j-a)
All dimensions are in mm
Minimum footprint SOT223
Thermal characteristics
Parameter
thermal resistance from junction
to solder point
thermal resistance from junction
to ambient
min
min
1.5
1.5
(3×)
min
1.5
3.8 min
4.6
2.3
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All information provided in this document is subject to legal disclaimers.
6.3
Conditions
full cycle; see
full cycle; printed circuit board mounted:
minimum footprint; see
full cycle; printed circuit board mounted:
pad area; see
Rev. 05 — 21 March 2011
Figure 8
Figure 7
(35 um thick)
Fig 7.
Figure 6
All dimensions are in mm
Printed circuit board:
FR4 epoxy glass (1.6 mm thick), copper laminate
Printed circuit board pad area: SOT223
60
10
9
4.6
Min
-
-
-
36
15
50
7
Typ
-
156
70
Z0103NN
© NXP B.V. 2011. All rights reserved.
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Max
15
-
-
4.5
18
4Q Triac
Unit
K/W
K/W
K/W
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