OT406,135 NXP Semiconductors, OT406,135 Datasheet
OT406,135
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OT406,135 Summary of contents
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OT406 Four-quadrant triac, enhanced noise immunity Rev. 01 — 19 May 2008 1. Product profile 1.1 General description Passivated sensitive gate triac in a SOT223 surface-mountable plastic package 1.2 Features I Sensitive gate I Direct interfacing to logic level ICs ...
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... NXP Semiconductors 3. Ordering information Table 2. Ordering information Type number Package Name OT406 SC-73 4. Limiting values Table 3. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Parameter V repetitive peak off-state voltage DRM V repetitive peak reverse voltage RRM I RMS on-state current ...
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... NXP Semiconductors 2.0 conduction form P angle factor tot (W) (degrees 2.8 90 2.2 120 1.9 1.2 180 1.57 0.8 0.4 0.0 0 0.2 = conduction angle Fig 1. Total power dissipation as a function of RMS on-state current; maximum values 16 I TSM ( Fig 2. Non-repetitive peak on-state current as a function of the number of sinusoidal current cycles; maximum ...
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... NXP Semiconductors TSM ( (1) ( (1) dI /dt limit T ( quadrant limit Fig 3. Non-repetitive peak on-state current as a function of pulse width; maximum values 8 I T(RMS) ( 103 C sp Fig 4. RMS on-state current as a function of surge duration; maximum values OT406_1 Product data sheet - 003aac269 I T(RMS) ( surge duration (s) Fig 5. Rev. 01 — ...
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... NXP Semiconductors 5. Thermal characteristics Table 4. Thermal characteristics Symbol Parameter R thermal resistance from junction to th(j-sp) solder point R thermal resistance from junction to th(j-a) ambient 2 th(j-sp Fig 6. Transient thermal impedance from junction to solder point as a function of pulse width OT406_1 Product data sheet Four-quadrant triac, enhanced noise immunity Conditions full cycle ...
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... NXP Semiconductors 6. Static characteristics Table 5. Static characteristics unless otherwise specified. j Symbol Parameter I gate trigger current GT I latching current L I holding current H V on-state voltage T V gate trigger voltage GT I off-state current D OT406_1 Product data sheet Conditions 0.1 A; see Figure T2+ G+ ...
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... NXP Semiconductors 7. Dynamic characteristics Table 6. Dynamic characteristics Symbol Parameter dV /dt rate of rise of off-state voltage /dt rate of change of com commutating voltage 1 GT(25 C) 1.2 0.8 0 Fig 7. Normalized gate trigger voltage as a function of junction temperature OT406_1 Product data sheet Four-quadrant triac, enhanced noise immunity Conditions = 0.67V ...
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... NXP Semiconductors (A) 1.6 1.2 0.8 (1) 0 0.4 0 1.254 0. ( 125 C; typical values j ( 125 C; maximum values j ( maximum values j Fig 9. On-state current as a function of on-state voltage Fig 11. Normalized holding current as a function of junction temperature OT406_1 Product data sheet 003aac258 I I L(25 C) (2) (3) 1.2 1.6 ...
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... NXP Semiconductors 8. Package outline Plastic surface-mounted package with increased heatsink; 4 leads DIMENSIONS (mm are the original dimensions) UNIT 1.8 0.10 0.80 3.1 mm 1.5 0.01 0.60 2.9 OUTLINE VERSION IEC SOT223 Fig 12. Package outline SOT223 (SC-73) OT406_1 Product data sheet scale 0.32 6.7 3 ...
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... NXP Semiconductors 9. Mounting 9.1 Mounting instructions All dimensions are in mm Fig 13. Minimum footprint SOT223 9.2 Printed-circuit board All dimensions are in mm Printed-circuit board: FR4 epoxy glass (1.6 mm thick), copper laminate (35 m thick) Fig 14. Printed-circuit board pad area SOT223 OT406_1 Product data sheet Four-quadrant triac, enhanced noise immunity 3 ...
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... NXP Semiconductors 10. Revision history Table 7. Revision history Document ID Release date OT406_1 20080519 OT406_1 Product data sheet Four-quadrant triac, enhanced noise immunity Data sheet status Change notice Product data sheet - Rev. 01 — 19 May 2008 OT406 Supersedes - © NXP B.V. 2008. All rights reserved. ...
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... Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice ...
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... NXP Semiconductors 13. Contents 1 Product profi 1.1 General description 1.2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.4 Quick reference data Pinning information . . . . . . . . . . . . . . . . . . . . . . 1 3 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 4 Limiting values Thermal characteristics Static characteristics Dynamic characteristics . . . . . . . . . . . . . . . . . . 7 8 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 9 9 Mounting 9.1 Mounting instructions . . . . . . . . . . . . . . . . . . . 10 9.2 Printed-circuit board . . . . . . . . . . . . . . . . . . . . 10 10 Revision history ...