PCKEL14D-T NXP Semiconductors, PCKEL14D-T Datasheet

Clock Drivers & Distribution 2.5/3.3V PECL/ECL 1:5 CLK DRVR

PCKEL14D-T

Manufacturer Part Number

PCKEL14D-T

Description

Clock Drivers & Distribution 2.5/3.3V PECL/ECL 1:5 CLK DRVR

Manufacturer

NXP Semiconductors

Type

Clock Driverr

Datasheet

1.PCKEL14PW-T.pdf (15 pages)

Specifications of PCKEL14D-T

Number Of Clock Inputs

Output Frequency

>1000MHz

Output Logic Level

ECL/PECL

Operating Supply Voltage (min)

-2.375/2.375V

Operating Supply Voltage (typ)

-2.5/-3.3/2.5/3.3V

Operating Supply Voltage (max)

-3.8/3.8V

Operating Temp Range

-40C to 85C

Operating Temperature Classification

Industrial

Signal Type

ECL/PECL

Mounting

Surface Mount

Pin Count

Mounting Style

SMD/SMT

Package / Case

SOT-163

Lead Free Status / RoHS Status

Compliant

Other names

PCKEL14D,118

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1. Description

2. Features

The PCKEL14 is a low skew 1:5 clock distribution chip designed explicitly for low

skew clock distribution applications. The device can be driven by either a differential

or single-ended ECL, or if positive power supplies are used, PECL input signal. The

PCKEL14 is designed to operate in ECL or PECL mode for a voltage supply range of

The PCKEL14 features a multiplexed clock input to allow for the distribution of a lower

speed scan or test clock along with the high speed system clock. When LOW (or left

open and pulled LOW by the input pull-down resistor), the SEL pin will select the

differential clock input.

The common enable (EN) is synchronous, so that the outputs will only be

enabled/disabled when they are already in the LOW state. This avoids any chance of

generating a runt clock pulse when the device is enabled/disabled, as can happen

with an asynchronous control. The internal ﬂip-ﬂop is clocked on the falling edge of

the input clock, therefore all associated speciﬁcation limits are referenced to the

negative edge of the clock input.

The V

For single-ended conditions, the unused differential input is connected to V

switching reference voltage. V

decouple V

0.1 mA. When not used, V

2.375 V to 3.8 V (or 2.375 V to 3.8 V).

PCKEL14

2.5 V/3.3 V PECL/ECL 1:5 clock distribution chip

Rev. 01 — 14 October 2002

50 ps output-to-output skew at 3.3 V

Synchronous enable/disable

Multiplexed clock input

ESD protection: > 2.5 kV HBM

The PCK series contains temperature compensation

PECL mode operating range: V

NECL mode operating range: V

Internal 75 k pull-down resistors on all inputs, plus a 37.5 k pull-up on CLK

Q output will default LOW with inputs open or at V

Meets or exceeds JEDEC spec EIA/JESD78 IC latch-up test

Moisture sensitivity level 1

Flammability rating: UL-94 code V-0 @ 1/8”

pin (an internally generated voltage supply) is available to this device only.

and V

via a 0.01 F capacitor and limit current sourcing or sinking to

should be left open.

may also rebias AC-coupled inputs. When used,

= 2.375 V to 3.8 V, with V

= 0 V, with V

= 2.375 V to 3.8 V

= 0 V

Product data

as a

Related parts for PCKEL14D-T

PCKEL14D-T Summary of contents

Page 1

PCKEL14 2.5 V/3.3 V PECL/ECL 1:5 clock distribution chip Rev. 01 — 14 October 2002 1. Description The PCKEL14 is a low skew 1:5 clock distribution chip designed explicitly for low skew clock distribution applications. The device can be driven ...

Page 2

Philips Semiconductors 3. Pinning information 3.1 Pinning Fig 1. SO20 pin conﬁguration. 3.2 Pin description Table 1: Symbol Q0-Q4 Q0- SEL V BB CLK CLK SCLK 3.2.1 Power supply connection CAUTION 9397 750 09564 ...

Page 3

... Philips Semiconductors 4. Ordering information Table 2: Ordering information Type number Package Name Description PCKEL14D SO20 plastic small outline package; 20 leads; body width 7.5 mm PCKEL14PW TSSOP20 plastic thin shrink small outline package; 20 leads; body width 4 Logic diagram Fig 3. Logic diagram. CAUTION 6. Function table Table Don’ ...

Page 4

Philips Semiconductors 7. Limiting values Table 4: Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Parameter V power supply CC V power supply EE V input voltage I I output current sink/source ...

Page 5

Philips Semiconductors 8. Static characteristics Table 5: PECL DC characteristics [ 2 Symbol Parameter I power supply current EE V HIGH-level output OH voltage V LOW-level output OL voltage V HIGH-level ...

Page 6

Philips Semiconductors Table 6: Positive DC characteristics [ 3 Symbol Parameter Conditions I power supply current EE V HIGH-level output OH voltage V LOW-level output OL voltage V HIGH-level input single-ended ...

Page 7

Philips Semiconductors Table 7: Negative DC characteristics 2.375 Symbol Parameter Conditions I power supply EE current V HIGH-level OH output voltage V LOW-level OL output voltage V HIGH-level ...

Page 8

Philips Semiconductors 9. Dynamic characteristics Table 8: AC characteristics (V = 2.375 Symbol Parameter Conditions f maximum toggle see max frequency t LOW-to-HIGH CLK to Q (diff); PLH ...

Page 9

Philips Semiconductors 900 V O (mV p-p ) 800 700 600 500 400 300 200 100 0 Fig 150 mV and 1000 mV input. max 10. Application information Fig 5. Typical termination for output driver and device ...

Page 10

Philips Semiconductors 11. Package outline SO20: plastic small outline package; 20 leads; body width 7 pin 1 index 1 e DIMENSIONS (inch dimensions are derived from the original mm dimensions) A UNIT ...

Page 11

Philips Semiconductors TSSOP20: plastic thin shrink small outline package; 20 leads; body width 4 pin 1 index 1 e DIMENSIONS (mm are the original dimensions) A UNIT max. 0.15 0.95 ...

Page 12

Philips Semiconductors 12. Soldering 12.1 Introduction to soldering surface mount packages This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our Data Handbook IC26; Integrated Circuit Packages ...

Page 13

Philips Semiconductors During placement and before soldering, the package must be ﬁxed with a droplet of adhesive. The adhesive can be applied by screen printing, pin transfer or syringe dispensing. The package can be soldered after the adhesive is cured. ...

Page 14

Philips Semiconductors 14. Data sheet status [1] Level Data sheet status Product status I Objective data Development II Preliminary data Qualiﬁcation III Product data Production [1] Please consult the most recently issued data sheet before initiating or completing a design. ...

Page 15

Philips Semiconductors Contents 1 Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 2 Features . . . ...

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