PCKEP14PW-T NXP Semiconductors, PCKEP14PW-T Datasheet
PCKEP14PW-T
Specifications of PCKEP14PW-T
Related parts for PCKEP14PW-T
PCKEP14PW-T Summary of contents
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PCKEP14 2.5 V/3.3 V 1:5 differential ECL/PECL/HSTL clock driver Rev. 01 — 30 October 2002 1. Description The PCKEP14 is a low skew 1-to-5 differential driver, designed with clock distribution in mind, accepting two clock sources into an input multiplexer. ...
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Philips Semiconductors 3. Pinning information 3.1 Pinning Fig 1. SO20 pin configuration. 3.2 Pin description Table 1: Symbol Q0-Q4 Q0- CLK_SEL CLK0, CLK1 CLK0, CLK1 3.2.1 Power supply connection CAUTION 9397 750 09565 ...
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... Philips Semiconductors 4. Ordering information Table 2: Ordering information Type number Package Name PCKEP14D SO20 PCKEP14PW TSSOP20 5. Logic diagram Fig 3. Logic diagram. CAUTION 9397 750 09565 Product data 2.5 V/3.3 V 1:5 differential ECL/PECL/HSTL clock driver Description plastic small outline package 8 leads; body width 7.5 mm plastic thin shrink small outline package ...
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Philips Semiconductors 6. Function table Table 3: CLK0 [1] On next negative transition of CLK0 or CLK1. 7. Attributes Table 4: Characteristic internal input pull-down resistor internal input pull-up resistor ESD protection moisture sensitivity, indefinite ...
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Philips Semiconductors 8. Limiting values Table 5: Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Parameter V PECL mode power supply CC V NECL mode power supply EE V PECL mode input voltage I NECL ...
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Philips Semiconductors Table 7: PECL DC characteristics [ 3 Symbol Parameter I power supply current EE V HIGH-level output OH voltage V LOW-level output OL voltage V HIGH-level input IH voltage ...
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Philips Semiconductors Table 8: NECL DC characteristics 3 2.375 Symbol Parameter Conditions I power supply EE current V HIGH-level output OH voltage V LOW-level output OL voltage V HIGH-level ...
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Philips Semiconductors 10. Dynamic characteristics Table 10: AC characteristics ( 2.375 Symbol Parameter Conditions f maximum toggle see max(PECL/ frequency HSTL propagation delay to ...
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Philips Semiconductors 11. Application information Fig 5. Typical termination for output driver and device evaluation. 9397 750 09565 Product data 2.5 V/3.3 V 1:5 differential ECL/PECL/HSTL clock driver Q DRIVER DEVICE 2 ...
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Philips Semiconductors 12. Package outline SO20: plastic small outline package; 20 leads; body width 7 pin 1 index 1 e DIMENSIONS (inch dimensions are derived from the original mm dimensions) A UNIT ...
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Philips Semiconductors TSSOP20: plastic thin shrink small outline package; 20 leads; body width 4 pin 1 index 1 e DIMENSIONS (mm are the original dimensions) A UNIT max. 0.15 0.95 ...
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Philips Semiconductors 13. Soldering 13.1 Introduction to soldering surface mount packages This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our Data Handbook IC26; Integrated Circuit Packages ...
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Philips Semiconductors During placement and before soldering, the package must be fixed with a droplet of adhesive. The adhesive can be applied by screen printing, pin transfer or syringe dispensing. The package can be soldered after the adhesive is cured. ...
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Philips Semiconductors 15. Data sheet status [1] Level Data sheet status Product status I Objective data Development II Preliminary data Qualification III Product data Production [1] Please consult the most recently issued data sheet before initiating or completing a design. ...
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Philips Semiconductors Contents 1 Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 2 Features . . . ...