104130-4 TE Connectivity, 104130-4 Datasheet - Page 185

• Manufacturer Part Number: 104130-4
• Description: Conn Ejector Header HDR 20 POS 2.54mm Solder RA Thru-Hole
• Manufacturer: TE Connectivity
• Type: Ejector Headerr

Specifications of 104130-4

• Pitch: 2.54 mm
• Number Of Rows: 2
• Number Of Contacts: 20
• Gender: HDR
• Contact Plating: Gold Over Nickel
• Termination Method: Solder
• Pitch (mm): 2.54mm
• Number Of Contact Rows: 2
• Mounting Style: Through Hole
• Body Orientation: Right Angle
• Operating Temp Range: -65C to 105C
• Current Rating (max): 1/ContactA
• Contact Material: Copper Alloy
• Housing Material: Thermoplastic
• Housing Color: Black
• Product Height (mm): 9.14mm
• Product Length (mm): 33.02mm
• Product Depth (mm): 25.83mm
• Width: 1.300"
• Peak Reflow Compatible (260 C): No
• Terminal Type: Right Angle PCB Thru Hole
• Body Material: Thermoplastic
• Leaded Process Compatible: No
• Mounting Type: Through Hole
• Rohs Compliant: No
• Product Line: AMP-LATCH
• Profile: Low
• Pcb Mounting Orientation: Right Angle
• Pcb Mount Retention: Without
• Mating Connector Lock: Without
• Housing Style: 4-Sided
• Ejection Latches: With
• Post Size (mm [in]): 0.64 [.025]
• Shrouded: Yes
• [shrouded] End Dimension (mm [in]): 3.81 [0.150]
• Current Rating (a): 1
• Insulation Resistance (m?): 5,000
• Termination Post Length (mm [in]): 3.43 [0.135]
• Solder Tail Contact Plating: Tin-Lead over Nickel
• Header Type: Pin Header
• Number Of Positions: 20
• Centerline, Matrix (mm [in]): 2.54 x 2.54 [.100 x .100]
• Daisy Chain: With
• Preloaded: Yes
• Contact Plating, Mating Area, Material: Gold (30), Gold Flash over Palladium Nickel
• Contact Shape: Square
• Contact Base Material: Copper Alloy
• Connector Style: Header - Pin
• Mating Alignment Type: Center, Dual Polarizing Bar
• Mating Alignment: With
• Ul Flammability Rating: UL 94V-0
• Rohs/elv Compliance: Not ELV/RoHS compliant
• Lead Free Solder Processes: Not suitable for lead free processing
• Approved Standards: UL E28476, CSA LR7189
• Operating Temperature (°c): -65 – +105
• Temperature Rating: Standard
• Lead Free Status / RoHS Status: Not Compliant

Product Facts
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Catalog 1307819
Revised 8-08
www.tycoelectronics.com
Surface Mount Leads
Contact Material:
phosphor bronze
High temperature, black
thermoplastic housings,
94V-0 rated, capable of
withstanding IR or vapor-
phase reflow
Gold/tin duplex plating
for reliable mating
interconnection and solder
interface
Metallic hold downs provide
retention in the PC board
prior to and during the
reflow process … and strain
relief after soldering
Hold downs provide for
proper lead-to-pad
registration
Closed-entry receptacle
housings provide lead-in
ramp for positive mating
Receptacle contacts employ
dual cantilever beams for
reliable connections
Recognized under the
Component Program
of Underwriters
Laboratories Inc.
File No. E28476
Certified by
Canadian Standards
Association,
File No. LR 7189
R
are metric equivalents.
Dimensions are in inches and
millimeters unless otherwise
specified. Values in brackets
R
AMPMODU Interconnection System
Mod IV Surface Mount Vertical Receptacle Assemblies,
.100 x .100 [2.54 x 2.54] Centerline
The AMPMODU 0.025 [0.64]
square interconnection
system is an industry
standard that has provided
level III and IV thru-hole
interconnections to almost
every industry and
marketplace for years.
As technology advances,
so has the AMPMODU
product line.
Surface mount vertical
receptacle assemblies are
available to meet your level
II packaging needs as
process technologies
evolve from wave soldering
to surface mount reflow
(infrared and vapor-phase)
processes. AMPMODU
surface mount receptacle
assemblies are offered in
vertical dual entry
configurations. These
receptacles are available in
single-row and double-row
configurations with a
contact centerline spacing
of .100 x .100 [2.54 x 2.54].
Dimensions are shown for
reference purposes only.
Specifications subject
to change.
AMPMODU surface mount
vertical receptacle
assemblies continue to
provide the proven features
and benefits of their
thru-hole counterparts in the
AMPMODU product family.
Closed-entry style housing
design provides a lead-in
ramp for positive mating of
contacts, virtually eliminating
the possibility of stubbing.
The dual-beam receptacle
contact design, coupled with
gold plating in the contact
area, provides a reliable
interface. Tin plating on the
solder tails also enhances
solderability.
The incorporation of
compliant metallic hold
downs on receptacle
assemblies offers multiple
benefits. The hold downs
provide for proper lead-to-
pad registration and provide
retention to the PC board
prior to and during
processing. Used with a
plated thru-hole, the hold
USA: 1-800-522-6752
Canada: 1-905-470-4425
Mexico: 01-800-733-8926
C. America: 52-55-1106-0803
downs are soldered during
the reflow process and
serve as a strain relief for
the solder joints during
mating/unmating.
The design of the hold
downs results in an
excellent ratio of
insertion/extraction forces
(into the PC board); 20 lb.
[89 N] maximum insertion
force per pair and 10 lb.
[44.5 N] minimum extraction
force per pair (unsoldered).
No tools are required for
insertion.
South America: 55-11-2103-6000
Hong Kong: 852-2735-1628
Japan: 81-44-844-8013
UK: 44-8706-080-208
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