104130-4 TE Connectivity, 104130-4 Datasheet - Page 33

Conn Ejector Header HDR 20 POS 2.54mm Solder RA Thru-Hole

104130-4

Manufacturer Part Number
104130-4
Description
Conn Ejector Header HDR 20 POS 2.54mm Solder RA Thru-Hole
Manufacturer
TE Connectivity
Type
Ejector Headerr
Datasheets

Specifications of 104130-4

Pitch
2.54 mm
Number Of Rows
2
Number Of Contacts
20
Gender
HDR
Contact Plating
Gold Over Nickel
Termination Method
Solder
Pitch (mm)
2.54mm
Number Of Contact Rows
2
Mounting Style
Through Hole
Body Orientation
Right Angle
Operating Temp Range
-65C to 105C
Current Rating (max)
1/ContactA
Contact Material
Copper Alloy
Housing Material
Thermoplastic
Housing Color
Black
Product Height (mm)
9.14mm
Product Length (mm)
33.02mm
Product Depth (mm)
25.83mm
Width
1.300"
Peak Reflow Compatible (260 C)
No
Terminal Type
Right Angle PCB Thru Hole
Body Material
Thermoplastic
Leaded Process Compatible
No
Mounting Type
Through Hole
Rohs Compliant
No
Product Line
AMP-LATCH
Profile
Low
Pcb Mounting Orientation
Right Angle
Pcb Mount Retention
Without
Mating Connector Lock
Without
Housing Style
4-Sided
Ejection Latches
With
Post Size (mm [in])
0.64 [.025]
Shrouded
Yes
[shrouded] End Dimension (mm [in])
3.81 [0.150]
Current Rating (a)
1
Insulation Resistance (m?)
5,000
Termination Post Length (mm [in])
3.43 [0.135]
Solder Tail Contact Plating
Tin-Lead over Nickel
Header Type
Pin Header
Number Of Positions
20
Centerline, Matrix (mm [in])
2.54 x 2.54 [.100 x .100]
Daisy Chain
With
Preloaded
Yes
Contact Plating, Mating Area, Material
Gold (30), Gold Flash over Palladium Nickel
Contact Shape
Square
Contact Base Material
Copper Alloy
Connector Style
Header - Pin
Mating Alignment Type
Center, Dual Polarizing Bar
Mating Alignment
With
Ul Flammability Rating
UL 94V-0
Rohs/elv Compliance
Not ELV/RoHS compliant
Lead Free Solder Processes
Not suitable for lead free processing
Approved Standards
UL E28476, CSA LR7189
Operating Temperature (°c)
-65 – +105
Temperature Rating
Standard
Lead Free Status / RoHS Status
Not Compliant
Material and Finish
Housing — Glass-filled thermoplastic,
black, 94V-0 rated
Contacts — Copper alloy; duplex
plated .000030 [0.00076] gold in
mating area, .000150 [0.00381] tin
on solder posts, with entire contact
underplated .000050 [0.00127] nickel
Related Product Data
Performance Specifications —
page 63
Mateable Connectors — pages 37,
38, 49, & 50
Board-to-Board Spacing — page 63
PC Board Hole Layout — page 41
Technical Documents
Product Specification 108-1093
Application Specification
114-25031
Catalog 1307819
Revised 8-08
www.tycoelectronics.com
Single Row, Vertical
— page 64
are metric equivalents.
Dimensions are in inches and
millimeters unless otherwise
specified. Values in brackets
AMPMODU Interconnection System
Thru-Hole Headers––Unshrouded, .050 x .100 [1.27 x 2.54] Centerline,
Board-to-Board
[2.54]
Note: All part numbers are RoHS compliant.
.100
[3.18]
.125
No. of
Pos.
10
20
25
4
6
8
Dimensions are shown for
reference purposes only.
Specifications subject
to change.
[1.27]
.050 Typ.
(Continued)
A
[0.38]
.015
1.015 [25.78]
1.265 [32.13]
USA: 1-800-522-6752
Canada: 1-905-470-4425
Mexico: 01-800-733-8926
C. America: 52-55-1106-0803
Dimension
.215 [5.46]
.315 [8.00]
.415 [10.54]
.515 [13.08]
A
[2.54]
.100
South America: 55-11-2103-6000
Hong Kong: 852-2735-1628
Japan: 81-44-844-8013
UK: 44-8706-080-208
5-104178-1
5-104178-3
5-104178-5
5-104178-6
6-104178-1
6-104178-3
Numbers
[2.44]
.096
Part
[1.22]
.048
33
3

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