LU82541PI Intel, LU82541PI Datasheet - Page 33
LU82541PI
Manufacturer Part Number
LU82541PI
Description
Manufacturer
Intel
Datasheet
1.LU82541PI.pdf
(46 pages)
Specifications of LU82541PI
Operating Temperature Classification
Commercial
Mounting
Surface Mount
Pin Count
196
Lead Free Status / RoHS Status
Compliant
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5.0
5.1
Figure 11. 82541(PI/GI/EI) Mechanical Specifications
Note: No changes to existing soldering processes are needed for the 0.32 mm substrate change.
Package Information
Package and Pinout Information
This section describes the 82541(PI/GI/EI) device physical characteristics. The pin number-to-
signal mapping is indicated beginning with
The 82541(PI/GI/EI) device is a 196-lead plastic ball grid array (BGA) measuring 15 mm by
15 mm. The package dimensions are detailed below. The nominal ball pitch is 1 mm.
0.32 +/-0.04
1.56 +/-0.19
0.40 +/-0.10
0.85
Table
14.
Networking Silicon — 82541(PI/GI/EI)
Seating Plate
30
o
33