CPC7593ZC IXYS, CPC7593ZC Datasheet - Page 22

• Manufacturer Part Number: CPC7593ZC
• Manufacturer: IXYS

Specifications of CPC7593ZC

• Lead Free Status / RoHS Status: Supplier Unconfirmed

CPC7593
NOTE: For optimum solder joint size, MLP package
printed circuit board lands should extend no more than
0.05 mm past the chip post on the short sides, and no
more than 0.025 mm past the chip posts on the long
sides.
22
3.1.2 CPC7593B - 28 Pin SOIC Package
3.1.3 CPC7593M - 28 Pin MLP Package
(0.0355 ±0.0039)
(0.0008 +0.0012/-0.0008)
Pin 1
0.02 +0.03/-0.02
(0.096 MIN/0.104 MAX)
PIN 28
2.438 MIN/2.642 MAX
0.90 ± 0.10
PIN 1
(0.014 MIN/0.018 MAX TYP)
0.366 MIN/0.467 MAX TYP
(0.050 TYP)
1.270 TYP
TOP VIEW
(0.4334)
11.0
17.983 MIN/18.085 MAX
(0.708 MIN/0.712 MAX)
SIDE VIEW
(0.0079)
(0.2758)
0.20
7.0
Seating Plane
(0.0146)
0.37
(0.0071)
0.18
www.clare.com
(0.0240)
0.61
(0.026±0.004)
0.660±0.102
(0.0071)
0.18
(0.291 MIN/0.299 MAX)
7.391 MIN/7.595 MAX
(0.088 MIN/0.096 MAX)
2.235 MIN/2.438 MAX
(0.1970±0.0020)
(0.0217
Dimensions in mm (inches)
Dimensions and tolerances conform to ANSI Y14.5M-1994
5.0±0.05
As the metallic pad on the bottom of the MLP package
is connected to the substrate of the die, Clare
recommends that no printed circuit board traces cross
this area to avoid potential shorting issues.
0.55 ± 0.10
±
0.0040)
10.109 MIN/10.516 MAX
(0.0295)
(0.398 MIN/0.414 MAX)
0.75
(0.2955 ± 0.0020)
(0.020 MIN/0.040 MAX)
0.508 MIN/1.016 MAX)
(0.010 MIN/0.029 MAX X 45°)
BOTTOM VIEW
0.254 MIN/0.737 MAX X 45°
7.5 ± 0.05
DIMENSIONS
(INCHES)
MM
(0.0130 +0.0028/
0.33 +0.07/
-0.05
(0.0276)
Bottom side
metallic pad
(0.0236)
0.70
(0.0091 MIN/0.0125MAX)
0.2311 MIN/0.3175 MAX
0.60
-0.0020
)
R02