PIC32MX664F128H-I/MR Microchip Technology, PIC32MX664F128H-I/MR Datasheet - Page 182

• Manufacturer Part Number: PIC32MX664F128H-I/MR
• Description: 64 PINS, 128KB Flash, 32KB RAM, 80 MHz, USB, Ethernet, 4 DMA 64 QFN 9x9x0.9mm TU
• Manufacturer: Microchip Technology
• Series: PIC® 32MXr

Specifications of PIC32MX664F128H-I/MR

• Core Processor: MIPS32® M4K™
• Core Size: 32-Bit
• Speed: 80MHz
• Connectivity: Ethernet, I²C, SPI, UART/USART, USB OTG
• Peripherals: Brown-out Detect/Reset, DMA, POR, PWM, WDT
• Number Of I /o: 53
• Program Memory Size: 128KB (128K x 8)
• Program Memory Type: FLASH
• Ram Size: 32K x 8
• Voltage - Supply (vcc/vdd): 2.3 V ~ 3.6 V
• Data Converters: A/D 16x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 64-VFQFN Exposed Pad
• Processor Series: PIC32MX5x
• Core: MIPS32
• Data Bus Width: 32 bit
• Data Ram Size: 32 KB
• Interface Type: I2C, SPI, USART
• Maximum Clock Frequency: 80 MHz
• Number Of Programmable I/os: 53
• Number Of Timers: 5
• Operating Supply Voltage: 2.3 V to 3.6 V
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Lead Free Status / Rohs Status: Details

PIC32MX5XX/6XX/7XX
31.1
TABLE 31-1:
TABLE 31-2:
TABLE 31-3:
TABLE 31-4:
DS61156F-page 182
DC5
PIC32MX5XX/6XX/7XX
Power Dissipation:
Internal Chip Power Dissipation:
I/O Pin Power Dissipation:
Maximum Allowed Power Dissipation
Package Thermal Resistance, 121-Pin XBGA (10x10x1.1 mm)
Package Thermal Resistance, 100-Pin TQFP (14x14x1 mm)
Package Thermal Resistance, 100-Pin TQFP (12x12x1 mm)
Package Thermal Resistance, 64-Pin TQFP (10x10x1 mm)
Package Thermal Resistance, 64-Pin QFN (9x9x0.9 mm)
Note 1:
DC CHARACTERISTICS
Operating Voltage
DC10
DC12
DC16
DC17
Note 1:
Characteristic
Param.
No.
Operating Junction Temperature Range
DC Characteristics
P
I/O = S (({V
Operating Ambient Temperature Range
V
V
V
S
Symbol
INT
DD
DR
POR
VDD
Junction to ambient thermal resistance, Theta-
This is the limit to which V
= V
DD
OPERATING MIPS VS. VOLTAGE
THERMAL OPERATING CONDITIONS
THERMAL PACKAGING CHARACTERISTICS
DC TEMPERATURE AND VOLTAGE SPECIFICATIONS
Supply Voltage
RAM Data Retention Voltage
(Note 1)
V
to Ensure Internal
Power-on Reset Signal
V
to Ensure Internal
Power-on Reset Signal
DD
x (I
DD
DD
V
– V
DD
(in Volts)
Start Voltage
Rise Rate
DD
2.3-3.6V
Characteristics
OH
– S I
Characteristics
Range
} x I
Rating
OH
OH
)
) + S (V
DD
can be lowered without losing RAM data.
OL
x I
OL
-40°C to +85°C
Temp. Range
))
Standard Operating Conditions: 2.3V to 3.6V
(unless otherwise stated)
Operating temperature
0.00005
(in °C)
Min.
1.75
1.75
2.3
JA
( θ
JA
) numbers are achieved by package simulations.
Typical
—
—
—
—
Symbol
Symbol Typical
P
DMAX
θ
θ
θ
θ
θ
P
T
T
JA
JA
JA
JA
JA
A
D
J
0.115
Max.
3.6
2.1
—
-40°C ≤ T
Min.
-40
-40
40
43
43
47
28
PIC32MX5XX/6XX/7XX
Units
V/ μ s
(T
V
V
V
© 2010 Microchip Technology Inc.
P
A
Max. Frequency
J
INT
Typical
≤ +85°C for Industrial
– T
Max.
—
—
—
—
—
—
—
+ P
80 MHz
A
)/ θ
I
/
O
JA
Conditions
°C/W
°C/W
°C/W
°C/W
°C/W
Max.
+125
Unit
+85
—
—
—
—
Notes
Unit
°C
°C
W
W
1
1
1
1
1