S29JL032J70TFI420 Spansion Inc., S29JL032J70TFI420 Datasheet - Page 14
![no-image](/images/manufacturer_photos/0/6/621/spansion_inc__sml.jpg)
S29JL032J70TFI420
Manufacturer Part Number
S29JL032J70TFI420
Description
IC 3V 32M SIMULTANEOUS READ/WRITE FLASH
Manufacturer
Spansion Inc.
Datasheet
1.S29JL032J70TFI420.pdf
(64 pages)
Specifications of S29JL032J70TFI420
Cell Type
NOR
Density
32Mb
Access Time (max)
70ns
Interface Type
Serial
Boot Type
Bottom
Address Bus
22/21Bit
Operating Supply Voltage (typ)
3/3.3V
Operating Temp Range
-40C to 85C
Package Type
TSOP
Program/erase Volt (typ)
2.7 to 3.6V
Sync/async
Asynchronous
Operating Temperature Classification
Industrial
Operating Supply Voltage (min)
2.7V
Operating Supply Voltage (max)
3.6V
Word Size
8/16Bit
Number Of Words
4M/2M
Supply Current
16mA
Mounting
Surface Mount
Pin Count
48
Lead Free Status / Rohs Status
Supplier Unconfirmed
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
7.
14
Ordering Information
The order number (Valid Combination) is formed by the following:
Note:
1. Type 0 is standard. Specify others as required.
Valid Combinations
Valid Combinations list configurations planned to be supported in volume for this device. Consult your local
Spansion sales office to confirm availability of specific valid combinations and to check on newly released
combinations.
Device Number/
S29JL032J
Description
S29JL032J
Device Family
S29JL032J
3.0 Volt-only, 32 Mbit (2 M x 16-Bit/4 M x 8-Bit) Simultaneous Read/Write Flash Memory
Manufactured on 110 nm process technology
60
Speed (ns)
60, 70
T
F
Package Type
I
D a t a
BH
TF
01
0
S29JL032J
S29JL032J Valid Combinations
S h e e t
Temperature
Packing Type
0 = Tray
3 = 13-inch Tape and Reel
Model Number
01 = Top Boot Device, 4 Banks: 4/12/12/4 Mb
02 = Bottom Boot Device, 4 Banks: 4/12/12/4 Mb
21 = Top Boot Device, 2 Banks: 4/28 Mb
22 = Bottom Boot Device, 2 Banks: 4/28 Mb
31 = Top Boot Device, 2 Banks: 8/24 Mb
32 = Bottom Boot Device, 2 Banks: 8/24 Mb
41 = Top Boot Device, 2 Banks: 16/16 Mb
42 = Bottom Boot Device, 2 Banks: 16/16 Mb
Temperature Range
I
Package Material Set
F = Pb-free
H = Low-halogen, Pb-free
Package Type
B = Fine-pitch Ball Grid Array Package
T = Thin Small Outline Package (TSOP) Standard Pinout
Speed Option
60 = 60 ns
70 = 70 ns
Range
= Industrial (–40°C to +85°C)
I
( P r e l i m i n a r y )
01, 02, 21, 22, 31, 32, 41, 42
Ordering Options
Additional
31, 32
S29JL032J_00_03 August 25, 2010
Packing
0, 3
Type
(1)
VBK048
TS048
Description
Package
TSOP
FBGA