S29JL032J70TFI420 Spansion Inc., S29JL032J70TFI420 Datasheet - Page 61

• Manufacturer Part Number: S29JL032J70TFI420
• Description: IC 3V 32M SIMULTANEOUS READ/WRITE FLASH
• Manufacturer: Spansion Inc.

Specifications of S29JL032J70TFI420

• Cell Type: NOR
• Density: 32Mb
• Access Time (max): 70ns
• Interface Type: Serial
• Boot Type: Bottom
• Address Bus: 22/21Bit
• Operating Supply Voltage (typ): 3/3.3V
• Operating Temp Range: -40C to 85C
• Package Type: TSOP
• Program/erase Volt (typ): 2.7 to 3.6V
• Sync/async: Asynchronous
• Operating Temperature Classification: Industrial
• Operating Supply Voltage (min): 2.7V
• Operating Supply Voltage (max): 3.6V
• Word Size: 8/16Bit
• Number Of Words: 4M/2M
• Supply Current: 16mA
• Mounting: Surface Mount
• Pin Count: 48
• Lead Free Status / Rohs Status: Supplier Unconfirmed

20.2
August 25, 2010 S29JL032J_00_03
VBK048—48-Pin FBGA
PACKAGE
JEDEC
SYMBOL
SD / SE
MD
D1
ME
A1
E1
φb
A
D
N
E
e
D a t a
MIN
0.18
0.33
---
8.15 mm x 6.15 mm NOM
PACKAGE
8.15 BSC.
6.15 BSC.
5.60 BSC.
4.00 BSC.
0.80 BSC.
0.40 BSC.
VBK 048
NOM
N/A
---
---
48
---
---
S h e e t
8
6
MAX
1.00
0.43
---
( P r e l i m i n a r y )
OVERALL THICKNESS
BALL HEIGHT
BODY SIZE
BODY SIZE
BALL FOOTPRINT
BALL FOOTPRINT
ROW MATRIX SIZE D DIRECTION
ROW MATRIX SIZE E DIRECTION
TOTAL BALL COUNT
BALL DIAMETER
BALL PITCH
SOLDER BALL PLACEMENT
DEPOPULATED SOLDER BALLS
S29JL032J
NOTE
NOTES:
10
1.
2.
3.
4.
5.
6
7
8.
9.
DIMENSIONING AND TOLERANCING PER ASME Y14.5M-1994.
ALL DIMENSIONS ARE IN MILLIMETERS.
BALL POSITION DESIGNATION PER JESD 95-1, SPP-010 (EXCEPT
AS NOTED).
SYMBOL "MD" IS THE BALL ROW MATRIX SIZE IN THE
"D" DIRECTION.
SYMBOL "ME" IS THE BALL COLUMN MATRIX SIZE IN THE
"E" DIRECTION.
N IS THE TOTAL NUMBER OF SOLDER BALLS.
DIMENSION "b" IS MEASURED AT THE MAXIMUM BALL
DIAMETER IN A PLANE PARALLEL TO DATUM C.
SD AND SE ARE MEASURED WITH RESPECT TO DATUMS
A AND B AND DEFINE THE POSITION OF THE CENTER
SOLDER BALL IN THE OUTER ROW.
WHEN THERE IS AN ODD NUMBER OF SOLDER BALLS IN
THE OUTER ROW PARALLEL TO THE D OR E DIMENSION,
RESPECTIVELY, SD OR SE = 0.000.
WHEN THERE IS AN EVEN NUMBER OF SOLDER BALLS IN
THE OUTER ROW, SD OR SE = e/2
NOT USED.
"+" INDICATES THE THEORETICAL CENTER OF DEPOPULATED
BALLS.
A1 CORNER TO BE IDENTIFIED BY CHAMFER, LASER OR INK
MARK, METALLIZED MARK INDENTATION OR OTHER MEANS.
e REPRESENTS THE SOLDER BALL GRID PITCH.
g1001.2 \ f16-038.25 \ 07.13.10
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