ISP1506ABS-S NXP Semiconductors, ISP1506ABS-S Datasheet - Page 72
ISP1506ABS-S
Manufacturer Part Number
ISP1506ABS-S
Description
Manufacturer
NXP Semiconductors
Datasheet
1.ISP1506ABS-S.pdf
(80 pages)
Specifications of ISP1506ABS-S
Number Of Transceivers
1
Esd Protection
YeskV
Operating Supply Voltage (typ)
Not RequiredV
Operating Temperature Classification
Industrial
Operating Supply Voltage (max)
Not RequiredV
Operating Supply Voltage (min)
Not RequiredV
Mounting
Surface Mount
Operating Temperature (max)
85C
Operating Temperature (min)
-40C
Lead Free Status / RoHS Status
Compliant
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NXP Semiconductors
ISP1506A_ISP1506B_2
Product data sheet
18.4 Reflow soldering
Key characteristics in reflow soldering are:
Table 58.
Table 59.
Moisture sensitivity precautions, as indicated on the packing, must be respected at all
times.
Studies have shown that small packages reach higher temperatures during reflow
soldering, see
Package thickness (mm)
< 2.5
Package thickness (mm)
< 1.6
1.6 to 2.5
> 2.5
•
•
•
2.5
Lead-free versus SnPb soldering; note that a lead-free reflow process usually leads to
higher minimum peak temperatures (see
reducing the process window
Solder paste printing issues including smearing, release, and adjusting the process
window for a mix of large and small components on one board
Reflow temperature profile; this profile includes preheat, reflow (in which the board is
heated to the peak temperature) and cooling down. It is imperative that the peak
temperature is high enough for the solder to make reliable solder joints (a solder paste
characteristic). In addition, the peak temperature must be low enough that the
packages and/or boards are not damaged. The peak temperature of the package
depends on package thickness and volume and is classified in accordance with
Table 58
SnPb eutectic process (from J-STD-020C)
Lead-free process (from J-STD-020C)
and
Figure
59
36.
Rev. 02 — 28 August 2008
Package reflow temperature ( C)
Volume (mm
< 350
235
220
Package reflow temperature ( C)
Volume (mm
< 350
260
260
250
3
3
)
)
Figure
ISP1506A; ISP1506B
350 to 2000
260
250
245
36) than a SnPb process, thus
ULPI HS USB OTG transceiver
220
220
350
> 2000
260
245
245
© NXP B.V. 2008. All rights reserved.
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