ISP1109BS,118 NXP Semiconductors, ISP1109BS,118 Datasheet - Page 53

• Manufacturer Part Number: ISP1109BS,118
• Description: RF Transceiver USB FS TRANSCVR
• Manufacturer: NXP Semiconductors

Specifications of ISP1109BS,118

• Number Of Transceivers: 1
• Esd Protection: YeskV
• Power Supply Requirement: Triple
• Operating Supply Voltage (typ): Not RequiredV
• Operating Temperature Classification: Industrial
• Operating Supply Voltage (max): Not RequiredV
• Operating Supply Voltage (min): Not RequiredV
• Pin Count: 32
• Mounting: Surface Mount
• Operating Temperature (max): 85C
• Operating Temperature (min): -40C
• Operating Supply Voltage: 1.65 V to 5.25 V
• Lead Free Status / RoHS Status: Compliant
• Other names: 935276024118 ISP1109BS-T

Philips Semiconductors
20. Abbreviations
21. References
9397 750 13355
Product data sheet
[4]
[5]
[6]
[7]
[8]
[9]
Table 64:
[1]
[2]
[3]
[4]
Acronym
ATX
DC
ESD
I
LSB
MIC
MSB
OTG
POR
PORP
RxD
SE1
SoC
SPI
SRP
TxD
UART
USB
2
C-bus
These packages are not suitable for wave soldering. On versions with the heatsink on the bottom side, the
solder cannot penetrate between the printed-circuit board and the heatsink. On versions with the heatsink
on the top side, the solder might be deposited on the heatsink surface.
If wave soldering is considered, then the package must be placed at a 45 angle to the solder wave
direction. The package footprint must incorporate solder thieves downstream and at the side corners.
Wave soldering is suitable for LQFP, QFP and TQFP packages with a pitch (e) larger than 0.8 mm; it is
definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
Wave soldering is suitable for SSOP, TSSOP, VSO and VSSOP packages with a pitch (e) equal to or larger
than 0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
Image sensor packages in principle should not be soldered. They are mounted in sockets or delivered
pre-mounted on flex foil. However, the image sensor package can be mounted by the client on a flex foil by
using a hot bar soldering process. The appropriate soldering profile can be provided on request.
Hot bar soldering or manual soldering is suitable for PMFP packages.
Universal Serial Bus Specification Rev. 2.0
CEA 936 A, Mini-USB Analog Carkit Interface
The I
ECN_27%_ Resistor (http://www.usb.org/developers/docs).
Abbreviations
2
C-bus Specification; Version 2.1
Description
Analog USB transceiver
Direct Current
Electro-Static Discharge
Inter IC-bus
Least Significant Bit
Microphone
Most Significant Bit
On-The-Go
Power-On Reset
Power-On Reset Pulse
Receive Data
Single-Ended One
System-on-a-Chip
Serial Parallel Interface
Session Request Protocol
Transmit Data
Universal Asynchronous Receiver-Transmitter
Universal Serial Bus
Rev. 01 — 14 July 2005
USB transceiver with carkit support
© Koninklijke Philips Electronics N.V. 2005. All rights reserved.
ISP1109
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