ISP1106DH,118 NXP Semiconductors, ISP1106DH,118 Datasheet - Page 26
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ISP1106DH,118
Manufacturer Part Number
ISP1106DH,118
Description
RF Transceiver USB1.1 LOW VOLTAGE TRANSCEIVER
Manufacturer
NXP Semiconductors
Specifications of ISP1106DH,118
Number Of Transceivers
1
Esd Protection
YeskV
Power Supply Requirement
Triple
Operating Supply Voltage (typ)
Not RequiredV
Package Type
TSSOP
Operating Temperature Classification
Industrial
Operating Supply Voltage (max)
Not RequiredV
Operating Supply Voltage (min)
Not RequiredV
Dual Supply Voltage (typ)
1.8/2.5/3.3/5V
Dual Supply Voltage (max)
3.6/5.5V
Dual Supply Voltage (min)
1.65/3/4V
Pin Count
16
Mounting
Surface Mount
Operating Temperature (max)
85C
Operating Temperature (min)
-40C
Operating Supply Voltage
1.65 V to 3.6 V
Lead Free Status / RoHS Status
Compliant
Other names
935269824118 ISP1106DH-T
Philips Semiconductors
17. Additional soldering information
9397 750 11231
Product data
Fig 18. (H)BCC footprint and solder resist mask dimensions.
Cavity: exposed die pad, either functioning as heatsink or as ground connection; only for HBCC packages.
Normal
Corner
Cavity
Terminal
b 2
D h
b
b 1
17.1 (H)BCC packages: footprint
17.2 (H)BCC packages: reflow soldering profile
b 2
E h
The surface material of the terminals on the resin protrusion consists of a 4-layer
metal structure (Au, Pd, Ni and Pd). The Au + Pd layer (0.1 m min.) ensures
solderability, the Ni layer (5 m min.) prevents diffusion, and the Pd layer on top
(0.5 m min.) ensures effective wire bonding.
The conditions for reflow soldering of (H)BCC packages are as follows:
•
•
•
Preheating time: minimum 90 s at T = 145 to 155 C
Soldering time: minimum 90 s (BCC) or minimum 100 s (HBCC) at T > 183 C
Peak temperature:
PCB land
– Ambient temperature: T
– Device surface temperature: T
b 2
D h
b
b 1
b 2
E h
Rev. 08 — 19 February 2004
Solder resist mask
0.05
0.05
0.05
amb(max)
0.05
0.05
0.05
case(max)
= 260 C
(4 )
0.1
Stencil mask
0.05
= 255 C.
0.05
0.3 (8 )
0.05
© Koninklijke Philips Electronics N.V. 2004. All rights reserved.
0.05
Advanced USB transceivers
ISP1105/1106
Stencil print thickness:
0.1 to 0.12 mm
All dimensions in mm
For exact dimensions
see package outline
drawing (SOT639-2)
004aaa123
Solder land
Solder resist
Solder stencil
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