IS45S16100C1-7TA1 ISSI, Integrated Silicon Solution Inc, IS45S16100C1-7TA1 Datasheet - Page 81

• Manufacturer Part Number: IS45S16100C1-7TA1
• Manufacturer: ISSI, Integrated Silicon Solution Inc
• Type: SDRAMr

Specifications of IS45S16100C1-7TA1

• Organization: 1Mx16
• Density: 16Mb
• Address Bus: 12b
• Access Time (max): 6/5.5ns
• Maximum Clock Rate: 143MHz
• Operating Supply Voltage (typ): 3.3V
• Package Type: TSOP-II
• Operating Temp Range: -40C to 85C
• Operating Supply Voltage (max): 3.6V
• Operating Supply Voltage (min): 3V
• Supply Current: 150mA
• Pin Count: 50
• Mounting: Surface Mount
• Operating Temperature Classification: Industrial
• Lead Free Status / RoHS Status: Not Compliant

Integrated Silicon Solution, Inc. — www.issi.com —
Rev. F
06/18/03
PACKAGING INFORMATION
Plastic TSOP
Package Code: T (Type II)
Copyright © 2003 Integrated Silicon Solution, Inc. All rights reserved. ISSI reserves the right to make changes to this specification and its products at any time
without notice. ISSI assumes no liability arising out of the application or use of any information, products or services described herein. Customers are advised to
obtain the latest version of this device specification before relying on any published information and before placing orders for products.
No. Leads (N)
Ref. Std.
Symbol
ZD
A1
E1
C
D
A
E
b
e
L
N
1
.
Min
Millimeters
20.82 21.08
10.03 10.29
11.56 11.96
—
0.05
0.30
0.12
0.40
0°
1.27 BSC
0.95 REF
ZD
Max
1.20
0.15
0.52
0.21
0.60
5°
e
32
—
Min
D
0.002 0.006
0.012 0.020
0.005 0.008
0.820 0.830
0.391 0.400
0.451 0.466
0.016 0.024
0°
0.050 BSC
Inches
0.037 REF
Max
5°
0.047
Plastic TSOP (T - Type II)
N/2+1
N/2
b
18.31 18.52
10.03 10.29
11.56 11.96
—
Min
Millimeters
0.05
0.30
0.12
0.41
0°
0.80 BSC
0.81 REF
1-800-379-4774
E1
A
Max
1.20
0.15
0.45
0.21
0.60
5°
A1
44
E
—
Min
0.002 0.006
0.012 0.018
0.005 0.008
0.721 0.729
0.395 0.405
0.455 0.471
0.032 BSC
0.016 0.024
0°
Inches
0.032 REF
SEATING PLANE
Max
5°
0.047
Notes:
1. Controlling dimension: millimieters,
2. BSC = Basic lead spacing
3. Dimensions D and E1 do not
4. Formed leads shall be planar with
L
unless otherwise specified.
between centers.
include mold flash protrusions and
should be measured from the
bottom of the package.
respect to one another within
0.004 inches at the seating plane.
20.82 21.08
10.03 10.29
11.56 11.96
—
Min
Millimeters
0.05
0.30
0.12
0.80 BSC
0.40
0°
0.88 REF
Max
1.20
0.15
0.45
0.21
0.60
5°
ISSI
50
—
Min
0.002 0.006
0.012 0.018
0.005 0.008
0.820 0.830
0.395 0.405
0.455 0.471
0.016 0.024
0°
0.031 BSC
0.035 REF
Inches
α
Max
0.047
5°
C
®