MT47H64M16HR-3 Micron Technology Inc, MT47H64M16HR-3 Datasheet - Page 21

• Manufacturer Part Number: MT47H64M16HR-3
• Manufacturer: Micron Technology Inc

Specifications of MT47H64M16HR-3

• Lead Free Status / RoHS Status: Compliant

Figure 9: 60-Ball FBGA Package (8mm x 11.5mm) – x4, x8
PDF: 09005aef821ae8bf
Rev. O 9/08 EN
Dimensions
apply to solder
balls post reflow.
60X Ø0.45
8
Seating
0.12 A
plane
0.8 TYP
0.8 TYP
Note:
A
9
8
1. All dimensions are in millimeters.
7
8 ±0.15
6.4
3
2
1
A
B
C
D
E
F
G
H
J
K
L
Exposed
gold-plated pad
1.0mm (MAX) X
0.7mm (NOM)
nonconductive floating pad
0.8 ±0.1
Ball A1 ID
21
11.5 ±0.15
Micron Technology, Inc. reserves the right to change products or specifications without notice.
1.20 MAX
1Gb: x4, x8, x16 DDR2 SDRAM
0.25 MIN
© 2004 Micron Technology, Inc. All rights reserved.
Ball A1 ID location
Packaging