MT45W512KW16PGA-70 WT Micron Technology Inc, MT45W512KW16PGA-70 WT Datasheet

MT45W512KW16PGA-70 WT

Manufacturer Part Number
MT45W512KW16PGA-70 WT
Description
Manufacturer
Micron Technology Inc
Datasheet

Specifications of MT45W512KW16PGA-70 WT

Operating Temperature (max)
85C
Mounting
Surface Mount
Operating Temperature Classification
Commercial
Lead Free Status / RoHS Status
Compliant
Async/Page PSRAM Memory
MT45W512KW16PGA
For the latest data sheet, refer to Micron’s Web site:
Features
• Asynchronous and page mode interface
• Random access time: 70ns
• V
• Page mode read access:
• Low power consumption:
• Low power features:
Notes: 1. Contact factory for availability.
PDF: 09005aef8220472e/Source: 09005aef8220461e
8mb_asyncpage_ps1_0_p23z.fm - Rev. A 7/06 EN
Options
• Configuration
• Package
• Access time
• Operating temperature range
‡Products and specifications discussed herein are for evaluation and reference purposes only and are subject to change by
– 1.7V–1.95V V
– 1.7V–3.6V V
– 16-word page size
– Interpage read access: 70ns
– Intrapage read access: 20ns
– Asynchronous READ: <20mA
– Intrapage READ: <15mA
– Standby: 80µA
– Deep power-down: <10µA (TYP @ 25°C)
– Temperature compensated refresh (TCR)
– On-chip temperature sensor
– Partial array refresh (PAR)
– Deep power-down (DPD) mode
– 512K x 16
– 48-ball VFBGA (green)
– 70ns
– Wireless (–30°C to +85°C)
– Industrial (–40°C to +85°C)
Micron without notice. Products are only warranted by Micron to meet Micron’s production data sheet specifications.
CC
, V
CC
Q voltages:
CC
CC
Q
1
MT45W512KW16P
Designator
–70
WT
GA
IT
www.micron.com/products/psram/
1
Figure 1:
Micron Technology, Inc., reserves the right to change products or specifications without notice.
A
B
C
D
G
H
E
F
MT45W512KW16PGA-70WT
8Mb: 512K x 16 Async/Page PSRAM
DQ14
DQ15
V
V
DQ8
DQ9
A18
LB#
CC
1
SS
Ball Assignment – 48-Ball VFBGA
Q
Q
Part Number Example:
DQ10
DQ11
DQ12
DQ13
OE#
UB#
NC
A8
2
(Ball Down)
A17
A14
A12
A0
A3
Top View
A5
NC
A9
3
©2006 Micron Technology, Inc. All rights reserved.
A16
A15
A13
A10
A4
A1
A6
A7
4
DQ1
DQ3
DQ4
DQ5
WE#
A11
A2
CE#
5
DQ0
DQ2
DQ6
DQ7
ZZ#
V
V
NC
6
CC
SS
Features
Advance ‡

Related parts for MT45W512KW16PGA-70 WT

MT45W512KW16PGA-70 WT Summary of contents

Page 1

... Micron without notice. Products are only warranted by Micron to meet Micron’s production data sheet specifications. 8Mb: 512K x 16 Async/Page PSRAM www.micron.com/products/psram/ Figure Designator MT45W512KW16P GA MT45W512KW16PGA-70WT – Micron Technology, Inc., reserves the right to change products or specifications without notice. 1 Advance ‡ Features Ball Assignment – 48-Ball VFBGA ...

Page 2

General Description Micron low-power, portable applications. The MT45W512KW16P is an 8Mb DRAM core device organized as 512K x 16 bits. These devices include the industry-standard, asynchronous memory interface found on other low-power SRAM or PSRAM offerings. A user-accessible configuration register ...

Page 3

Ball Descriptions Table 1: VFBGA Ball Descriptions VFBGA Ball Assignment Symbol Type H1, D3, E4, F4, A[18:0] Input F3, G4, G3, H5, H4, H3, H2, D4, C4, C3, B4, B3, A5, A4 ZZ# Input B5 CE# Input A2 ...

Page 4

Bus Operations Table 2: Bus Operations Mode Power Standby Standby Read Active Write Active Idle No operation PAR Partial-array refresh DPD Deep power-down Active Load configuration register Notes: 1. When the device is in standby mode, control inputs (WE#, OE#), ...

Page 5

Part Numbering Information Micron PSRAM devices are available in several different configurations and densities (see Figure 3). Figure 3: Part Number Chart 512K W Micron Technology Product Family ® PSRAM/CellularRAM Memory Operating Core Voltage W ...

Page 6

Functional Description In general, the MT45W512KW16P device is a high-density alternative to SRAM and PSRAM products, popular in low-power, portable applications. The MT45W512KW16P contains an 8,388,608-bit DRAM core organized as 524,288 addresses by 16 bits. These devices include the industry-standard, ...

Page 7

Figure 5: READ Operation CE# OE# WE# ADDRESS DATA LB#/UB# Figure 6: WRITE Operation CE# OE# WE# ADDRESS DATA LB#/UB# PDF: 09005aef8220472e/Source: 09005aef8220461e 8mb_asyncpage_ps1_0_p23z.fm - Rev. A 7/06 EN 8Mb: 512K x 16 Async/Page PSRAM ADDRESS VALID DATA VALID t ...

Page 8

Page Mode READ Operation Page mode is a performance-enhancing extension to the legacy asynchronous READ operation. In page-mode-capable products, an initial asynchronous read access is performed. Adjacent addresses can then be quickly read by simply changing the low- order address. ...

Page 9

Low-Power Operation Standby Mode Operation During standby, the device current consumption is reduced to the level necessary to perform the DRAM refresh operation on the full array. Standby operation occurs when CE# and ZZ# are HIGH. The device will enter ...

Page 10

Figure 8: Software Access PAR Functionality NO Deep Power-Down (DPD) Operation DPD operation disables all refresh-related activity. This mode is used when the system does not require the storage provided by the PSRAM device. Any stored data will become corrupted ...

Page 11

Configuration Register (CR) Operation The CR defines how the PSRAM device performs its transparent self refresh. Altering the refresh parameters can dramatically reduce current consumption during standby mode. Page mode control is also embedded into the CR. This register can ...

Page 12

Figure 10: Software Access Load Configuration Register ADDRESS CE# OE# WE# LB#/UB# DATA Figure 11: Software Access Read Configuration Register ADDRESS CE# OE# WE# LB#/UB# DATA PDF: 09005aef8220472e/Source: 09005aef8220461e 8mb_asyncpage_ps1_0_p23z.fm - Rev. A 7/06 EN 8Mb: 512K x 16 Async/Page ...

Page 13

Figure 12: Configuration Register Bit Mapping All must be set to “0” CR[7] Page Mode Enable/Disable 0 Page Mode Disabled (default) 1 Page Mode Enabled CR[6] CR[ Partial Array Refresh (CR[2:0]) Default ...

Page 14

DPD operation disables all refresh-related activity. This mode will be used when the system does not require the storage provided by the PSRAM device. Any stored data will become corrupted when DPD is enabled. When refresh activity has been re-enabled, ...

Page 15

Electrical Characteristics Stresses greater than those listed in Table 4 may cause permanent damage to the device. This is a stress rating only, and functional operation of the device at these or any other conditions above those indicated in the ...

Page 16

Typical Standby Currents Figure 13 refers to the typical standby currents for the MT45W512KW16P device. The values shown in Figure 13 are measured with the on-chip temperature sensor control enabled (default setting). Figure 13: Typical Refresh Current vs. Temperature (I ...

Page 17

Table 6: DPD Specifications and Conditions Description Deep power-down Table 7: Capacitance Specifications and Conditions Description Input capacitance Input/output capacitance (DQ) Notes: 1. These parameters are verified in device characterization and are not 100 percent tested. Figure 14: AC Input/Output ...

Page 18

Table 8: READ Cycle Timing Requirements Parameter Address access time Page access time LB#/UB# access time LB#/UB# disable to High-Z output LB#/UB# enable to Low-Z output Maximum CE# pulse width Chip select access time Chip disable to High-Z output Chip ...

Page 19

Table 9: WRITE Cycle Timing Requirements Parameter Address setup time Address valid to end of write Byte select to end of write CE# HIGH time during write Chip enable to end of write Data hold from write time Data write ...

Page 20

Timing Diagrams Figure 16: Power-Up Initialization Period Vcc, VccQ = 1.7V Table 12: Initialization Timing Parameters Parameter Initialization period (required before normal operations) Figure 17: Load Configuration Register ADDRESS CE# LB#/UB# WE# OE# ZZ# Figure 18: Deep Power-Down – Entry/Exit ...

Page 21

Figure 19: Single READ Operation (WE ADDRESS CE# LB#/UB# OE# DATA-OUT Figure 20: Page Mode READ Operation (WE ADDRESS A[18:4] ADDRESS A[3:0] CE# LB#/UB# OE# DATA-OUT PDF: 09005aef8220472e/Source: 09005aef8220461e 8mb_asyncpage_ps1_0_p23z.fm - Rev. A 7/06 EN 8Mb: ...

Page 22

Figure 21: WRITE Cycle (WE# Control) ADDRESS CE# LB#/UB# WE# OE# DATA-IN DATA-OUT Figure 22: WRITE Cycle (CE# Control) ADDRESS CE# LB#/UB# OE# WE# DATA-IN DATA-OUT PDF: 09005aef8220472e/Source: 09005aef8220461e 8mb_asyncpage_ps1_0_p23z.fm - Rev. A 7/06 EN 8Mb: 512K x 16 Async/Page ...

Page 23

Figure 23: WRITE Cycle (LB#/UB# Control) ADDRESS CE# LB#/UB# WE# OE# DATA-IN DATA-OUT PDF: 09005aef8220472e/Source: 09005aef8220461e 8mb_asyncpage_ps1_0_p23z.fm - Rev. A 7/06 EN 8Mb: 512K x 16 Async/Page PSRAM t WC ADDRESS VALID ...

Page 24

Package Dimensions Figure 24: 48-Ball VFBGA 0.70 ±0.05 SEATING PLANE A 0.10 A 48X Ø0.37 DIMENSIONS APPLY 0.75 TO SOLDER BALLS TYP POST REFLOW. PRE-REFLOW BALL DIAMETER IS 0. 0.30 SMD BALL PAD. BALL A6 5.25 2.625 1.875 ...

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