NAND64GAH0HZA5E Micron Technology Inc, NAND64GAH0HZA5E Datasheet - Page 9

• Manufacturer Part Number: NAND64GAH0HZA5E
• Manufacturer: Micron Technology Inc

Specifications of NAND64GAH0HZA5E

• Operating Temperature (max): 85C
• Mounting: Surface Mount
• Operating Temperature Classification: Commercial
• Lead Free Status / RoHS Status: Supplier Unconfirmed

NAND32GAH0H, NAND64GAH0H
3.1
Figure 2.
1. The ball corresponding to V
3.2
Figure 3.
14
13
12
11
10
9
8
7
6
5
4
3
2
1
NC
NC
NC
NC
A
NC
NC
B
Package connections
LFBGA169 package connections (top view through package)
Form factor
The ball diameter, d, and the ball pitch, p, for the LFBGA169 package are:
Form factor
C
NC
NC
D
d = 0.30 mm (solder ball diameter)
p = 0.5 mm (ball pitch)
E
F
CCI
G
must be decoupled with an external capacitance.
DAT2
DAT1
DAT0
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
H
DAT7
DAT6
DAT5
DAT4
DAT3
NC
NC
NC
NC
NC
NC
NC
NC
NC
J
V CCQ
d
V CCQ
V SSQ
V CCI
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
K
NC
NC
NC
NC
NC
NC
NC
L
V SS
V CC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
M
V CC
NC
NC
NC
NC
NC
NC
NC
N
V SS
NC
NC
NC
NC
NC
NC
NC
NC
P
V SS
NC
NC
NC
NC
NC
NC
NC
R
V CC
NC
NC
NC
NC
NC
NC
NC
T
NC
V CC
V SS
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
U
NC
NC
NC
NC
NC
NC
V
p
NC
V CCQ
CMD
CLK
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
W
V CCQ
V SSQ
V SSQ
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
Y
Device physical description
V CCQ
V SSQ
V CCQ
V SSQ
NC
NC
NC
NC
NC
NC
NC
NC
NC
AA
NC
AB
AC
AD
NC
AE
NC
AF
AI13627
NC
NC
AG
NC
NC
NC
NC
AH
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AI13626