MT18HVS25672PKY-53EE1 Micron Technology Inc, MT18HVS25672PKY-53EE1 Datasheet - Page 4

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MT18HVS25672PKY-53EE1

Manufacturer Part Number
MT18HVS25672PKY-53EE1
Description
Manufacturer
Micron Technology Inc
Datasheet

Specifications of MT18HVS25672PKY-53EE1

Main Category
DRAM Module
Sub-category
DDR2 SDRAM
Module Type
244VLP MiniRDIMM
Device Core Size
72b
Organization
256Mx72
Total Density
2GByte
Chip Density
1Gb
Access Time (max)
50ps
Maximum Clock Rate
533MHz
Operating Supply Voltage (typ)
1.8V
Operating Current
1.233A
Number Of Elements
18
Operating Supply Voltage (max)
1.9V
Operating Supply Voltage (min)
1.7V
Operating Temp Range
0C to 70C
Operating Temperature Classification
Commercial
Pin Count
244
Mounting
Socket
Lead Free Status / RoHS Status
Compliant
Figure 2:
PDF: 09005aef8281e0a3/Source: 09005aef8281d7ea
HVS18C256_512x72PK.fm - Rev. A 8/07 EN
RAS#, CAS#, WE#
(RDQS0–RDQS8)
DQS0#–DQS8#
CKE0, CKE1#
ODT0, ODT1
DQS0–DQS8,
DQ0–DQ63
DM0–DM8
CK0, CK0#
BA0–BA2
SA0–SA2
CB0–CB7
Symbol
.
S0#, S1#
E
A0–A15
RESET#
P
RR
SDA
AR
SCL
_O
_I
N
UT
Pin Descriptions
(open drain)
(LVCMOS)
(SSTL_18)
(SSTL_18)
(SSTL_18)
(SSTL_18)
(SSTL_18)
(SSTL_18)
(SSTL_18)
(SSTL_18)
(SSTL_18)
(SSTL_18)
(SSTL_18)
(SSTL_18)
(SSTL_18)
(SSTL_18)
(SSTL_18)
Output
Input
Input
Input
Input
Input
Input
Input
Input
Input
Input
Input
Type
I/O
I/O
I/O
I/O
I/O
Description
Address inputs: Provide the row address for ACTIVE commands, and the column
address and auto precharge bit (A10) for READ/WRITE commands, to select one
location out of the memory array in the respective bank. A10 sampled during a
PRECHARGE command determines whether the PRECHARGE applies to one device
bank (A10 LOW, device bank selected by BA0–BA1/BA2) or all device banks (A10
HIGH). The address inputs also provide the op-code during a LM command.
A0–A13 (2GB) and A0–A14 (4GB). A0–A15 are connected for parity.
Bank address inputs: BA0–BA1/BA2 define to which device bank an ACTIVE, READ,
WRITE, or PRECHARGE command is being applied. BA0–BA1/BA2 define which mode
register, including MR, EMR, EMR(2), and EMR(3), is loaded during the LOAD MODE
command.
Clock: CK and CK# are differential clock inputs. All address and control input signals
are sampled on the crossing of the positive edge of CK and the negative edge of CK#.
Output data (DQs and DQS/DQS#) is referenced to the crossings of CK and CK#.
Clock enable: CKE (registered HIGH) activates and CKE (registered LOW) deactivates
clocking circuitry on the DDR2 SDRAM.
On-die termination: ODT (registered HIGH) enables termination resistance internal
to the DDR2 SDRAM. When enabled ODT is only applied to each of the following pins:
DQ, DQS, DQS#, RDQS, RDQS#, CB, and DM. The ODT input will be ignored if disabled
via the LOAD MODE (LM) command.
Parity bit for the address and control bus. The non-parity version is not used.
Command inputs: RAS#, CAS#, and WE# (along with S#) define the command being
entered.
Asynchronously forces all registered outputs LOW when RESET# is LOW. This signal can
be used during power up to ensure that CKE is LOW and DQs are High-Z.
Chip select: S# enables (registered LOW) and disables (registered HIGH) the command
decoder. All commands are masked when S# is registered HIGH. S# provides for
external rank selection on systems with multiple ranks. S# is considered part of the
command code.
Presence-detect address inputs: These pins are used to configure the presence-
detect device.
Serial clock for presence-detect: SCL is used to synchronize the presence-detect
data transfer to and from the module.
Check bits.
Data input mask: DM is an input mask signal for write data. Input data is masked
when DM is sampled HIGH along with that input data during a WRITE access. DM is
sampled on both edges of DQS. Although DM pins are input-only, the DM loading is
designed to match that of DQ and DQS pins. If RDQS is enabled, RDQS0#–RDQS8# are
used only during the READ command. If RDQS is disabled, RDQS0–RDQS8 become
DM0–DM8 and RDQS0#–RDQS8 are not used.
Data input/output: Bidirectional data bus.
Data strobe: Output with read data, input with write data for source synchronous
operation. Edge-aligned with read data, center-aligned with write data. DQS# is only
used when differential data strobe mode is enabled via the LM command.
Serial presence-detect data: SDA is a bidirectional pin used to transfer addresses
and data into and out of the presence-detect portion of the module.
Parity error found on the address and control bus. The non-parity version is not used.
2GB, 4GB (x72, DR) 244-Pin DDR2 VLP Mini-RDIMM
4
Micron Technology, Inc., reserves the right to change products or specifications without notice.
Pin Assignments and Descriptions
©2007 Micron Technology, Inc. All rights reserved.

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