MC9S08QG8CPBE Freescale, MC9S08QG8CPBE Datasheet - Page 97
MC9S08QG8CPBE
Manufacturer Part Number
MC9S08QG8CPBE
Description
Manufacturer
Freescale
Datasheet
1.MC9S08QG8CPBE.pdf
(314 pages)
Specifications of MC9S08QG8CPBE
Cpu Family
HCS08
Device Core Size
8b
Frequency (max)
20MHz
Interface Type
I2C/SCI/SPI
Total Internal Ram Size
512Byte
# I/os (max)
12
Number Of Timers - General Purpose
1
Operating Supply Voltage (typ)
2.5/3.3V
Operating Supply Voltage (max)
3.6V
Operating Supply Voltage (min)
1.8V
On-chip Adc
8-chx10-bit
Instruction Set Architecture
CISC
Operating Temp Range
-40C to 85C
Operating Temperature Classification
Industrial
Mounting
Through Hole
Pin Count
16
Package Type
PDIP
Program Memory Type
Flash
Program Memory Size
8KB
Lead Free Status / RoHS Status
Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
MC9S08QG8CPBE
Manufacturer:
CYPRESS
Quantity:
310
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Chapter 7 Central Processor Unit (S08CPUV2)
7.4.5
BGND Instruction
The BGND instruction is new to the HCS08 compared to the M68HC08. BGND would not be used in
normal user programs because it forces the CPU to stop processing user instructions and enter the active
background mode. The only way to resume execution of the user program is through reset or by a host
debug system issuing a GO, TRACE1, or TAGGO serial command through the background debug
interface.
Software-based breakpoints can be set by replacing an opcode at the desired breakpoint address with the
BGND opcode. When the program reaches this breakpoint address, the CPU is forced to active
background mode rather than continuing the user program.
MC9S08QG8 and MC9S08QG4 Data Sheet, Rev. 5
Freescale Semiconductor
95
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